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| Project Number: |
Title |
Initiation Date |
Committee |
Reserved Final Publication Number: |
| PN-5177 |
Altitude Immersion Test Procedure for Electrical Connectors |
05/01/2008 |
CE-2.0 |
EIA-364-03C |
| PN-5176 |
TEST PROCEDURES FOR ELECTRICAL CONNECTORS AND SOCKETS |
04/28/2008 |
CE-2.0 |
EIA-364-04A |
| PN-5175 |
Lightning Strike Test Procedure for Electrical Connectors |
04/14/2008 |
CE-2.0 |
EIA-364-75 |
| PN-5171 |
Electrical Connector / Socket Test Procedures Including Environmental Classifications |
06/21/2007 |
CE-2.0 |
EIA-364E |
| PN-5170 |
Cable Flexing Test Procedure for Electrical Connectors |
06/18/2007 |
CE-2.0 |
EIA-364-41D |
| PN-5169 |
Cable Pull-Out Test Procedure for Electrical Connectors |
06/18/2007 |
CE-2.0 |
EIA-364-38C |
| PN-5168 |
Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors and Sockets |
06/18/2007 |
CE-2.0 |
EIA-364-32E |
| PN-5167 |
TEST PROCEDURES FOR ELECTRICAL CONNECTORS AND SOCKETS |
06/07/2007 |
CE-2.0 |
EIA-364-19 |
| PN-5166 |
Fluid Immersion Test Procedure for Electrical Connectors and Sockets |
05/14/2007 |
CE-2.0 |
EIA-364-10E |
| PN-5165 |
China RoHS Environmental Friendly Use Period ( EFUP ) Marking Requirements |
05/23/2007 |
S-1 |
CB-24 |
| PN-5164 |
TEST PROCEDURE FOR DETERMINING THE TOTAL IONIC CONTAMINATION OF AN ELECTRICAL CONNECTOR OR SOCKET ASSEMBLY OR COMPONENT |
04/06/2007 |
CE-2.0 |
EIA-364-111 |
| PN-5163 |
Altitude - Low Temperature Test Procedure for Electrical Connectors |
03/23/2007 |
CE-2.0 |
EIA-364-105A |
| PN-5162 |
Contact Axial Concentricity Test Procedure for Electrical Connectors |
01/19/2007 |
CE-2.0 |
EIA-364-07C |
| PN-5161 |
Insulation Resistance Test Procedure for Electrical Connectors, Sockets, and Coaxial Contacts |
01/19/2007 |
CE-2.0 |
EIA-364-21D |
| PN-5160 |
Withstanding Voltage Test Procedure for Electrical Connectors, Sockets, and Coaxial Contacts |
01/19/2007 |
CE-2.0 |
EIA-364-20D |
| PN-5159 |
Material Composition Declaration for Electronic Products |
01/05/2007 |
EIA/EIC JIG |
JIG-101A |
| PN-5158 |
Resistance to Soldering Heat Test Procedure for Electrical Connectors and Sockets |
11/30/2006 |
CE-2.0 |
EIA-364-56D |
| PN-5157 |
Mating and Unmating Force Test Procedure for Electrical Connectors and Sockets |
11/30/2006 |
CE-2.0 |
EIA-364-13D |
| PN-5156 |
Temperature Life With or Without Electrical Load Test Procedure for Electrical Connectors and Sockets |
11/03/2006 |
CE-2.0 |
EIA-364-17C |
| PN-5155 |
Axial-Leaded, Glass Encapsulated Capacitors |
10/25/2006 |
P-2.1 |
EIA 198 Part III Section 7 |
| PN-5154 |
Axial-Leaded Capacitors,
Conformally Coated and Molded Types |
10/25/2006 |
P-2.1 |
EIA 198 Part III Section 6 |
| PN-5153 |
Radial-Leaded Capacitors,
Conformally Coated and Molded Types |
10/25/2006 |
P-2.1 |
EIA 198 Part III Section 4 |
| PN-5152 |
Radial-Leaded, Molded Capacitors |
10/25/2006 |
P-2.1 |
EIA-198 Part III Section 5 |
| PN-5151 |
High Voltage Multilayer Capacitors |
10/25/2006 |
P-2.1 |
EIA 198 Part III Section 9 |
| PN-5150 |
Humidity Test Procedure for Electrical Connectors and Sockets |
09/09/2006 |
CE-2.0 |
EIA-364-31C |
| PN-5149 |
Assembly Processing, Evaluation and Classification of Non-IC Electronic Components |
09/26/2006 |
S-1 |
TBD |
| PN-5143 |
Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in controlled environment Applications |
06/20/2006 |
CE-2.0 |
EIA-364-1000 |
| PN-5142 |
Test Procedures for Electrical Connectors and Sockets |
06/09/2006 |
CE-2.0 |
TBD |
| PN-5141 |
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires |
05/19/2006 |
STC |
J-STD-002C |
| PN-5138 |
Solid Tantalum Capacitor in Micromini Cases |
05/10/2006 |
P-2.5 |
TBD |
| PN-5137 |
Solid Tantalum Capacitor Molded Case with Facedown Terminations |
05/10/2006 |
P-2.5 |
TBD |
| PN-5136 |
Mating and Unmating Force Test Procedure for Electrical Connectors and Sockets |
01/26/2006 |
CE-2.0 |
EIA-364-13C |
| PN-5135 |
Capacitor Standard for IC Engine Cranking |
02/07/2006 |
KFI |
TBD |
| PN-5134 |
Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors and Sockets |
01/23/2006 |
CE-2.0 |
EIA-364-32D |
| PN-5133 |
ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR WHISKER SUSCEPTIBILITY OF Pb-FREE ALLOY SURFACE FINISHES |
01/19/2006 |
S-1 |
EIA/ECA CB23 |
| PN-5130 |
Mechanically-Interlocked Component Packaging for Automatic Handling |
01/18/2006 |
ACH |
EIA-704-A |
| PN-5129 |
Bare Die and Chip Scale Packages Taped in 8mm & 12mm Carrier Tape for Automatic Handling |
01/18/2006 |
ACH |
EIA-763-A |
| PN-5128 |
8mm Punched & Embossed Carrier Taping of Surface Mount Components for Automatic Handiling of Devices Generally Smaller than 20.mm x 1.2 mm |
01/18/2006 |
ACH |
EIA-726-A |
| PN-5127 |
Wire Bending Test Procedure for Insulation Displacement Contacts (IDC) for Electrical Connectors |
12/13/2005 |
CE-2.0 |
EIA-364-92 |
| PN-5126 |
Polarizing/Coding Key Overstress Test Procedure for Electrical Connectors and Sockets |
12/13/2005 |
CE-2.0 |
EIA-364-86 |
| PN-5125 |
Vibration Test Procedure for Electrical Connectors and Sockets |
11/10/2005 |
CE-2.0 |
EIA-364-28E |
| PN-5124 |
Resistance to Soldering Heat Test Procedure for Electrical Connectors and Sockets |
11/29/2005 |
CE-2.0 |
EIA-364-56C |
| PN-5123 |
Ball Grid Array (BGA) and Land Grid Array (LGA) Test Sequence for Electrical Connectors and Sockets |
10/10/2005 |
CE-2.0 |
EIA-364-1003 |
| PN-5122 |
Integrated Passive Device Product Registrations EIA-850 |
10/25/2005 |
P-10 |
EIA-850-A |
| PN-5121 |
Integrated Passive Device (IPD) Chipscale Package Design Guidelines EIA-800 |
10/25/2005 |
P-10 |
EIA-800-A |
| PN-5120 |
IPD Application Guideline |
10/13/2005 |
P-10 |
EIA/ECA 957-A |
| PN-5119 |
Archive the following standards: EIA-172-B, EIA-460, EIA-196-A, EIA-396, EIA-451, EIA-452 |
9/21/2005 |
P-1 |
N/A |
| PN-5118 |
Comments on Test Methods and Criteria for Tin Whiskers in Surface Mount Passive Devices |
9/21/2005 |
S-1 |
CB-22 |
| PN-5117 |
Correction to EIA 481 |
9/21/2005 |
S-1 |
CB-20 |
| PN-5116 |
ECA Guideline: Counterfeit Passive Components |
9/21/2005 |
S-1 |
CB-21 |
| PN-5115 |
Have You Seen Tin Whiskers? The Facts About Tin Whiskers |
9/21/2005 |
S-1 |
CB-19A |
| PN-5114 |
Electrical Socket Specifications |
7/7/2005 |
CE-2.0 |
EIA-540C000, 540CA00, 540CAAA, 540CAAB |
| PN-5113 |
Lightning Strike Test for Electrical Connectors |
7/24/2005 |
CE-2.0 |
EIA-364-75 |
| PN-5112 |
Electrical Socket Specifications |
7/13/2005 |
CE-2.0 |
|
| PN-5111 |
Low Temperature Test Procedure for Electrical Connectors and Sockets |
7/01/2005 |
CE-2.0 |
EIA-364-59A |
| PN-5110 |
Contact Strength Test Procedure for Electrical Connectors |
7/01/2005 |
CE-2.0 |
EIA-364-15A |
| PN-5109 |
Visual and Dimensional Inspection Test Procedure for Electrical Connectors and Sockets |
7/01/2005 |
CE-2.0 |
EIA-364-18B |
| PN-5106 |
Contact Resistance Test Procedure for Electrical Connectors |
6/11/2005 |
CE-2.0 |
EIA-364-06C |
| PN-5105 |
Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets |
6/11/2005 |
CE-2.0 |
EIA-364-23C |
| PN-5104 |
Surface Mount Command Mode Choke |
6/2/2005 |
P-3 |
EIA-958 |
| PN-5103 |
Fluid Immersion Test Procedure for Electrical Connectors and Sockets |
5/31/2005 |
CE-2.0 |
EIA-36410D |
| PN-5100 |
Visual and Mechanical Inspection for Molded Solid Tantalum Chip Capacitors |
5/18/2005 |
P-2.5 |
EIA-757-A |
| PN-5099 |
SMD Multilayer Ceramic Chip Capacitors |
N/A |
P-2.1 |
EIA-198-E III/3 |
| PN-5098 |
Solid Tantalum Capacitor Application Guide line |
5/18/2005 |
P-2.5 |
EIA-809A |
| PN-5097 |
Surface Mount Tantalum Capacitor Qualification Specification |
5/18/2005 |
P-2.5 |
EIA-717 |
| PN-5095 |
ANSI/EIA 521: Application Guide for Multilayer Ceramic Capacitors - Electrical |
N/A |
P-2.1 |
ANSI/EIA - 521 |
| PN-5094 |
Visual and Mechanical Inspection Multilayer Ceramic Chip Capacitors |
5/16/2005 |
P-2.1 |
EIA-595 A |
| PN-5093 |
New Standard Thin Film on Silicon Resistor Network Specification |
5/12/2005 |
P-1 |
TBA |
| PN-5092 |
Revision on EIA/IS-703 |
5/12/2005 |
P-1 |
EIA-703-A |
| PN-5091 |
Revision on EIA-887 |
5/12/2005 |
P-1 |
TBA |
| PN-5090 |
Revision on EIA-886 |
5/12/2005 |
P-1 |
TBA |
| PN-5089 |
Current Cycling Test for Electrical Connectors |
4/20/2005 |
CE-20 |
EIA/ECA-364-55A |
| PN-5088 |
Assembly Component Tray-ACT |
8/13/2004 |
ACH |
EIA-960 |
| PN-5087 |
Electrical and Electronic Component Hazardous Substance Free Standard and Requirements |
3/7/2005 |
ECCB |
EIA/ECCB-954 |
| PN-5086 |
Recission of EIA-364-89A |
3/3/2005 |
CE-2.0 |
TBA |
| PN-5085 |
Revision of EIA-364-46B |
3/3/2005 |
CE-2.0 |
EIA-364-46C |
| PN-5084 |
Revision of EIA-364-36B |
3/3/2005 |
CE-2.0 |
EIA-364-36C |
| PN-5083 |
Reaffirmation of 17 364 TP's |
2/20/2005 |
CE-2.0 |
TBA |
| PN-5082 |
Tray Standard |
10/13/2004 |
ACH |
TBA |
| PN-5081 |
Non-conventional small pitch & width |
10/13/2004 |
ACH |
TBA |
| PN-5080 |
Wave and Camber |
10/13/2004 |
ACH |
TBA |
| PN-5079 |
Niobium Caps |
10/13/2004 |
P-2.5 |
TBA |
| PN-5078 |
Upgrade IS-717 |
10/13/2004 |
P-2.5 |
EIA-717 |
| PN-5077 |
Revision of EIA-809 |
10/13/2004 |
P-2.5 |
EIA-809-A |
| PN-5076 |
Combine EIA-535BAAC & EIA-535BAAE |
10/13/2004 |
P-2.5 |
TBA |
| PN-5075 |
Niobiun Caps |
10/13/2004 |
P-14 |
TBA |
PN-5074
|
User's Application Guide to Fuses
|
10/28/2004
|
P-14
|
TBA
|
PN-5073
|
Low Voltage Supplemental Fuse Qualification Specification
|
10/28/2004
|
P-14
|
TBA
|
PN-5072
|
Surge Withstand Telecommunications Fuse Qualification
Specification
|
10/28/2004
|
P-14
|
TBA
|
| PN-5071 |
Metallic Coating Thickness Measurement of Contacts
Test Procedure for Electrical Connectors |
8/27/2004 |
ECA CE-2.0 |
EIA-364-48A |
| PN-5070 |
Engineering Specification for Vacuum Grade Monel
Alloy 404 (UNS N40400) for Vacuum Electron Devices |
8/17/2004 |
ECA MVED |
EIA/ECA-951 |
| PN-5069 |
Engineering Specification for Vacuum Grade 70
Copper 30 Nickel Alloy for Vacuum Electron Devices |
8/17/2004 |
ECA MVED |
EIA/ECA-950 |
| PN-5068 |
Engineering Specification for Metallized Beryllium
Oxide Ceramics |
8/17/2004 |
ECA MVED |
EIA/ECA-949 |
| PN-5067 |
Standard for Plans to Determine Lead Content of
Electronic Components and Related Equipment |
8/13/2004
Published SEP 2004 |
ECCB TPC-1 |
EIA/ECCB-952 |
| PN-5065 |
Resistance to Solvents Test Procedure for Electrical
Connectors and Sockets |
8/4/2004 |
ECA CE-2.0 |
EIA-364-11B |
| PN-5047 |
Materials Composition Declaration Guide |
1/23/2003 |
EIA MDG-1 |
TBA |
| PN-4996 |
Qualification Specification for Die Level Networks with Solder Bump Interconnects |
1/02/2002 |
P-10 |
EIA-961 |
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