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Joint Soldering Technology Committee
Tuesday, October 9, 2001
1:00 pm - 5:00 pm

1.0 Introductions and Roster Modifications

2.0 September Meeting Minutes Approval
2.1 Review/status of ANSI J STD-001C comments.....................Kwoka/Committee
2.2 J STD-002B work items.....................................................Hillman/Kwoka
2.2.1 "Active wetting" results on new samples/ test plan
using Actiec 2 flux (8ld SOIC,TO-220,208ld).............................Wenger/Wood
2.2.2 "Active wetting" results - board level referee.....................Hillman
2.3 IPC 5-23b/EIA STC/JEDEC JC 13 TG9901 joint test plan
2.3.1 Solder temperature 235C vs. 245C
2.3.2 3 s vs. 5 s solder immersion time
2.3.3 R vs. Actiec II flux
2.3.3.1 Component Test Sample Results
2.3.3.2 "Marginal" 44ld MQFP, 8ld SOIC, 14ld CERDIP, 14ld PDIP, 2 ld ChipCaps
2.3.4 Board level assembly results..........................................Wood/Moon/Williams

3.0 JEDEC Participation/Adoption in ANSI J STD-002B Revision...........Kwoka

4.0 Lead Free Testing and Evaluations...............................Kwoka
4.1 Current "lead free" activities - New Whisker Research

5.0 New Business and Opportunities..................................Committee

64.0 Next Meeting Location/Adjournment.........................Committee

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