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Minutes of P-3 Committee on Inductive Devices
October 3, 2000
Wyndham Hotel San Diego, CA

Name
Organization
Members Present
Cornelius Clark Cooper Electronic Technologies
William Gisseler TDK Corporation of America
Caddy Greenidge Vishay-Bradford
K. Lin for Daniel Chang AEM, Inc.
Leonard Metzger Panasonic Industrial Company
Brian Piscitelli KOA Speer Electronics
Paul Krystek IBM
Mark St. Clair Agilent Technologies
David Vernetti Steward
Members Absent
Yakov Belopolsky FCI/Berg Electronics
James Boytor Coilcraft, Inc.
Barry Friedman Lucent Technologies
Michael Foerster EPCOS, Inc.
Dennis Lieneman AVX Corporation
Tom Smiley BI Technologies
Others Present
Robert Blodgett Taiyo Yuden(USA) Inc.
Richard Drawz Boeing Commercial Airplane
Nick Ilie San-O-Industrial Corp.
Chuck Jackson Nvidia
Laird Macomber Cornell-Dubilier
Domingo Pichardo Lucent Technologies
Michael Radecki Defense Supply Center
Albert Tian AEM, Inc.
Michael Tinkleman EIA/ECA

1.0 Committee Organization and Procedures
1.1 Membership and Attendance

Self-introductions were made. Attendance was taken, and it was determined that a quorum was present. Membership list needs to be cleaned up to ensure that all committee members receive drafts to review. Action Item

1.2 Approval of April 5, 2000 Meeting Minutes

Add Bill Gisseler to list of members attending April 2000 meeting. Motion carried approving the April 2000 minutes

1.3 Approval of Agenda

Agenda was approved.

1.4 Correspondence

No correspondence.

2.0 Old Business
2.1 Review PN-4315 Draft "Surface Mount Ferrite Chip Bead Qualification Specification"

Committee went through draft in detail, and question arose on 4.5.1 f) "The impedance value shall not change by more than +/- 30% from the initial value."(also in 4.4 e)) Committee questioned whether +/- 30% is a realistic standard for impedance change across temperature range. Action Item Follow-up conference call with suppliers to get data on +/- 30% issue to present prior to 4/2001 meeting. Bill Gisseler will then update PN-4315.

2.2 Review merged Multilayer-Wirewound Specification draft.

Merger of EIA/IS-759, "Multilayer Chip Inductor Qualification Specification" with EIA/IS-760, "Surface Mount Wirewound Inductor Qualification Specification." Earlier draft of merged specification still needs to be located.

2.3 Review Parts Dimension and Land Patterns Document

Excel spreadsheet. Michael Griffith helped put it together. All case sizes of inductors and standard land patterns. All manufacturers surveyed. IPC normally recommends land patterns following P-4 mechanical outline guidelines. Request a PN Number. Action Item

2.4 PN-4233, "Surface Mount Inductor Qualification Specification"

4/2000 version was handed out at meeting. Updated version with strikeouts shown will be provided to committee. Michael Tinkleman, EIA/ECA will then do an e-mail to all committee members. Several iterations may be necessary. Action Items

Motion: - To ballot PN-4233 when revisions are complete. 5 - For, 4 - Abstentions - Approved. Roll call vote. 5 Yes votes - IBM, KOA Speer, Vishay, TDK & AEM. 4 Abstentions - Agilent, Cooper, Panasonic & Steward. Action Item

3.0 New Business and Opportunities
3.1 Inductor Application Guide

Continue to review whether application guide is needed.

4.0 Next Meeting

The next meeting will be at the 2nd Engineering Summit 4/23-25/2001 in San Antonio.

5.0 Adjournment

The Committee moved, seconded, and unanimously agreed to adjourn at 12:15PM.

6.0 Action Items

Membership list needs to be cleaned up to ensure that all committee members receive drafts to review.

PN-4315 - Follow-up conference call with suppliers to get data on +/- 30% issue to determine if it is a realistic value.

Parts Dimension and Land Patterns Document - Request a PN Number.

PN-4233 - Provide updated version with strikeouts shown.

Ballot PN-4233

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

Bill Gisseler, Chairperson
Signature on file

Michael Tinkleman, Secretary
Signature on file

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