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P-2.5 Tantalum Capacitors Committee WORKING GROUP

WEDNESDAY, October 8, 2003
Noon to 2:00 PM
Marriott Rivercenter Hotel, San Antonio TX

1. COMMITTEE ORGANIZATION AND PROCEDURES

1.1 Membership and attendance
1.2 Review and approve agenda
1.3 Approve minutes of last meeting , Tempe, AZ Spring of 2003
1.4 Correspondence

2. OLD BUSINESS

2.1 Reports

2.1.1 Passive Component User's Group (U.1)…………..Keith Seamands, Chairman
(Announcement of future meeting dates and locations)
2.1.2 Government Specifications and Standards……… DSCC Representative
Status of Mil-PRF-55365 Changes

2.2 Surface Mount Tantalum Capacitors

2.2.1 Status: Standard (EIA-535BAAC), Low ESR (EIA-535BAAE).
2.2.2 Discussion of new case sizes, ratings, or products….All Members
2.2.2.1 Non-molded miniature sizes 2012 and 1608.
2.2.3 Discussion: inclusion or deletion of ratings charts from molded specs.

2.3 High temperature (150C and up) applications for molded chip tantalums

2.4 Hazardous and recyclable material considerations for tantalum chips.

2.4.1 Lead free solder topics
2.4.2 Other industry trends on "materials reporting"

2.5 Review updates to Tantalum - Polymer draft specification
2.6 Discussion of moisture sensitivity tests for SMD solid and polymer tantalums
2.7 Review and update EIA list of "active working projects"
2.8 Review updates to Niobium draft specification

3. NEW BUSINESS
3.1 Date Code Re-certification-Update on activities?….All Members.
3.2 Solderability requirements at lead bend for molded chips....All Members

4. ADJOURNMENT

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