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Minutes of the P-2.5 Committee on Tantalum Capacitors
October 10, 2001
Loews Hotel, Philadelphia, PA

1.0 Committee Organization and Procedures

1.1 Membership and Attendance
The meeting was called-to-order at 10:05 AM by Dave Richardson, who was substituting for absent Chairperson, Nancy Reynolds. Self-introductions were made, attendance taken, and it was shown that a quorum was NOT present. Since not enough voting members were in attendance to have a Quorum, it was decided amongst the attendees that discussions would proceed to prepare for progress at the next meeting. Dave Holmes was appointed acting Secretary for the session.

1.2 Approval of Agenda
The group agreed to work off of the existing proposed agenda.

1.3 Approval of October, 2000 Meeting Minutes
Committee minutes from the Wednesday, 25 April 2001 meeting held at the Hyatt Hotel in San Antonio, TX were distributed and discussed. Approval was deferred due to lack of quorum.

1.4 Correspondence
No official correspondence received since the last meeting.

2.0 OLD BUSINESS

2.1 Reports

2.1.1 U-1 Committee Report
Discussed what the attendees could do to convince more Users to attend. Much of the discussion centered around demonstrating how attending could add value to their company.

Ron Gedney, from NEMI, gave a NEMI Roadmap presentation at the U-1 User's Group meeting. A copy of the presentation is attached to the U-1 meeting minutes.

2.1.2 DSCC Report of Government Specifications and Standards
There was no DSCC Representative at the meeting and no report had been sent to the Chair prior to the meeting.

2.2 Surface Mount Tantalum Capacitors

2.2.1 Status: Standard (EIA-535BAAC), Low ESR (EIA-535BAAE), and Fused Specifications.
Not Discussed

2.2.2 Discussion of new Case Sizes, Ratings, or Products
It was suggested that the ratings charts be taken out of the specifications (Standard (EIA-535BAAC), Low ESR (EIA-535BAAE), and Fused Specifications) altogether (rather than splitting chart out into sub set (slash sheet)) due to inability to keep up with newly released ratings. Instead of the ratings charts, include standard voltage ratings (4, 6.3, 10, 16, 20, 25, 35, 50) and decade ranges of capacitance (1, 4.7, 10, 15, 22, 33, 47, 68, 100, 150, 220, 330, 470, and 680).

User's commented that different companies using different letters for the same case sizes is confusing and needs to be standardized.

2.2.2.1 Non-molded miniature sizes 2012 and 1608
Need to update 2012 termination dimensions.
Add low profile - 2 mm max height and 1.5mm max height.

2.2.3 Global Standardization of Tantalum Specifications
Request was made for the EIA to provide a copy of the IEC spec to the committee at the next meeting for comparison/standardization purposes.

ACTION ITEM¾Ed Mikoski (EIA) agreed to bring a copy of the IEC spec to the next meeting. (Dave Richardson will tell him which specs to bring).

2.3 High-temperature (³150 °C) applications for molded chip tantalums
Recommended that a sub section be added to EIA-535BAAC to include high temperature molded chip tantalums (150°C).

2.4 Hazardous Material (Pb-free, etc…) considerations for Tantalum Chips

2.4.1 Report on NEMI lead free solder technology
Ron Gedney, from NEMI, gave a NEMI Roadmap presentation at the U-1 User's Group meeting. A copy of the presentation is attached to the U-1 meeting minutes.

2.5 Review updates to Tantalum - Polymer Draft Specification
Not discussed

2.6 Discussion of Moisture Sensitivity Level (MSL) Tests for SMD Solid and Polymer Tantalums
Will look at the IPC standard for moisture sensitivity. This issue will be discussed in the working group at the April 2002 meeting. Group would like to find a presenter on this issue as well.

2.7 Review of EIA Catalog Specification List
Per discussion, Ed Mikoski agreed to have the documents cited in Para 2.7 of the 25APR2001 minutes pulled from the catalog, since they are old and no longer determined as useful to the industry.

2.8 Review and update EIA list of Active working Projects
Per discussion, Ed Mikoski agreed to have the Project number PN-4129 "Fused Molded Tantalum Chip" withdrawn. This was voted on and approved by the committee in the 25APR2001 minutes Paragraph 2.8. Group also recommended that a new PN be issued to revise application guide to reflect polymer, high temperature chips, and niobium.

2.9 Update on Niobium capacitors
Producers agreed that they would be ready to discuss a Niobium Spec at the next meeting in April 2002.

3.0 NEW BUSINESS

3.1 Any new business
Meeting attendees discussed need for EMS/CM involvement due to the direction of the industry's business model. Also need to let people that have not come to several meetings in a row, know that they will be removed from voting member list.

ACTION ITEM-Ed Mikoski, EIA, will update voting member and attendee list on the EIA's system.

4.0 Next Meeting
The next meeting will be at the 4th ECA Engineering Summit Week of 14 April 2002 in Albuquerque, NM at the Sheraton Old Town Hotel.

5.0 Adjournment
The informal meeting was informally adjourned at 11:50 am EST.

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

Michael Mosier, Chairperson
Signature on file

Edward F. Mikoski, Jr., Acting Secretary
Signatures on file

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