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Home > Technology Center > Engineering Committees > P-2.5 Committee Minutes
of the P-2.5 Committee on Tantalum Capacitors
1
Committee Organization and Procedures The meeting was called-to-order at 4:15 PM by Dave Toomey, Chairperson. Self-introductions were made, attendance taken, and it was shown that a quorum was present. 1.2 Approval of the Agenda The Agenda was unanimously approved as written. 1.3 Approval of the Minutes The Minutes from the April, 2000 meeting were unanimously approved as written. 1.4 Correspondence No correspondence was received. 2. OLD BUSINESS 2.1 Reports
2.1.2 U-1 Committee Report The U-1 Committee meeting preceded the P-2.5 meetings earlier in the day with most of the P-2.5 attendees participating in the U-1 meeting. The next Engineering Summit will be 4/23-25/2001 in San Antonio. 2.1.3 DSCC Report of Government Specifications and Standards Michael Radecki distributed the latest DSCC report on Tantalum capacitors. The DSCC report is attached. 2.2 Surface Mount
Tantalum Capacitors PN 4837 (3/28/2000) has been issued for work on EIA-535BAAC, "Specification for Fixed Tantalum Chip Capacitors, Style 1 Protected (Molded)". This specification needs to be updated for new ratings. In the P-2.5 Working Group meeting earlier in the day, it was agreed that committee would go forward with current version of specifications with the addition of a slash sheet for numbers that will change frequently. A Task Group to update the Slash Sheets was formed. Its members include Mike Griffith, Nancy Reynolds and Dave Toomey. PN 4838 (3/28/2000) has being issued for work on EIA-535BAAE, "Detailed Specification for Low ESR Molded Tantalum Chip Capacitors." 2.2.1 Discussion of new Case Sizes, Ratings, or Products The committee voted unanimously at the April 2000 meeting to adopt a new case size naming convention. The existing 4 digits will continue to identify the nominal Length and Width, in millimeters. The alpha characters previously used to designate Low or High profile will be replaced with 2 additional digits to identify the maximum Height, in millimeters, for all case size codes. The new codes will be hyphenated as LLWW-HH. Note that the actual height dimensions for all case sizes will include a tolerance. (The low profile types were previously specified with only a maximum dimension. Although we will use the maximum height in the naming scheme, the actual case requirements will still require a lower and upper limit.) 2.2.2 Global Standardization of Tantalum Specifications The Committee would like to get two of the Tantalum specifications into the IEC system. They are EIA-809, "Solid Tantalum Capacitor Application Guideline."(6/99) and EIA/IS-717, "Surface Mount Tantalum Capacitor Qualification Specification."(4/97) They would get published as an IEC "new work proposal." Five countries each need to nominate six experts to work on these IEC "new work proposals." There was some question on the logistics of this process including any needed copy right releases, and finding electronic copies of the EIA-809 and EIA/IS-717 to send to IEC. Action Item Several automotive companies are investigating 150C requirements for tantalum capacitors. The committee will continue to track these activities to see if there is enough interest to warrant developing a standard. 2.4 Hazardous Material (Pb-free, etc…) considerations for Tantalum Chips Committee is continuing
to track the lead-free issue and the groups involved and the lead-free
combinations suggested to see what impacts they would have on tantalum
capacitors. At the next meeting they would like to have a report on
the "Lead-free Working Group" (Not part of the NEMI efforts.)
This lead-free group is looking more at component end of the issues.
Not looking at soldering alloys. Also question of how can ECA work with
the NEMI Lead-free working group. 2.5 Tantalum chips with Polymer Electrolyte Systems Preliminary draft document being worked on. Need to add case sizes where there are no ratings yet. There were also some discussions on ways to move document preparation along between committee meetings. Items suggested included e-mailing document to committee members; a teleconference; and looking at ways to make use of the ECA web site such as a committee discussion group. Action Item 3. NEW BUSINESS There was no new
business to discuss. The next meeting will be at the 2nd Engineering Summit 4/23-25/2001 in San Antonio. 5 ADJOURNMENT The Committee moved, seconded, and unanimously agreed to adjourn at 5:42 PM. 6 ACTION ITEMS Update specifications in the EIA catalog including marking those that are rescinded. Attachment to the minutes a list of active P-2.5 specifications and working projects. (Attached) Resolve questions on the logistics of getting EIA-809 and EIA/IS-717 into the IEC system. Information on NEMI Lead-free activities to the committee and other P-Committees. Tantalum Chips with Polymer Electrolyte Systems - look for ways to move document preparation along between committee meetings.
Dave Toomey, Chairperson Nancy Reynolds/Michael
Tinkleman, Secretary
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