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Minutes of the P-2.5 Committee on Tantalum Capacitors
April 17, 2002
Sheraton Old Town Inn, Albuquerque, NM

*Not used in determination of quorum due to committee member inactivity.

1.0 Committee Organization and Procedures

1.1 Membership and Attendance
The meeting was called-to-order at 12:15 PM by Dave Richardson, who was substituting for absent Chairperson, Nancy Reynolds. Self-introductions were made, attendance taken, and it was shown that a quorum was present. Dave Holmes was appointed acting Secretary for the session.

1.2 Approval of Agenda
The group agreed to work off of the existing proposed agenda.

1.3 Approval of Meeting Minutes
1.3.1 Approval of April, 2001 San Antonio Meeting Minutes

1.4 Correspondence
No official correspondence received since the last meeting.

2.0 OLD BUSINESS

2.1 Reports
2.1.1 Passive Component User's Group (U.1) - Dave Richardson, Vice- Chairman - Next meeting will be in Charlotte, NC in October, 2002
Bill Serjak of H.C. Stark gave a presentation on Ta and Nb supply.

2.1.2 Government Specifications and Standards - DSCC Representatives Ken Beymer and Dennis Cross
There will be a meeting in Columbus, OH on May 14-15 to discuss changes to Mil-PRF-55365. Proposed changes can be viewed on the DSCC web site.

2.1.3 P-2.5 Working Group Report - Report by Dave Richardson
The working group met on Tuesday, April 16, 2002 from 2-4 pm.
Topics discussed:
New case sizes are needed. Lower voltages (below 4 volts) may be needed.
Bill Serjak of HC Stark spoke on raw material technical subjects
An update may be needed to the Tantalum Application Guide. Information on Niobium could be added.
Updates may be needed for the Tantalum Qualification spec (EIA IS 717)
Status of the Tantalum/Polymer spec was discussed and tabled for P2.5 meeting.
It was suggested that the Fused tantalum spec (PN-4129) may be dropped.
Polymer Qualification could be added to Tantalum Qual spec (717)
New case sizes - 0805 and 0603 may be added to Tantalum spec via PN 4837
Discussion on removing ratings tables from EIA 535BAAC tantalum chip spec since they are always in need of correction as industry brings out new ratings.
May want to consider bringing Nb and 150C automotive tantalum product into tantalum spec.
Delete PN-4840 from the active projects list since it has no Title or working description.

Attendees at Working Group Session:

2.1.4 Surface Mount Tantalum Capacitors
2.1.4.1 Status: Standard (EIA-535BAAC), Low ESR (EIA-535BAAE), and Fused Specifications. Update 2012 case dimensions.
PN4837 (EIA 535BAAC Rev B Std molded chip) - Add 0805(done), 0603 sizes, and 7260-38 add Nb, Remove Ratings Chart? Include reference to Qual spec 717 and reflow profiles. VOTE - PN 4837 to be kept open to revise specification.

PN 4840 (EIA 535BAAC Rev A) eliminate/rescind this PN. VOTE- voted to eliminate/close this Project Number.

PN 3565 (EIA EIA 717 Qual spec) add Polymer qualification, reflow profiles VOTE- voted to keep this PN open to continue work on Polymer spec. See IPC 9504 for Reflow information

PN 4129 (Molded Fused) - eliminate/rescind this PN number. Voted to close this PN.

PN 4838 (535BAAE Low ESR update) - eliminate/rescind. Voted to close this PN

PN 4904 (Polymer Send for Ballot) Vote to send April 1, 2001 draft to ballot if Dick Thompson determines it is the most current revision.

Dave Richardson will organize a conference call to discuss these specs further before the next regularly scheduled meeting.

2.1.5 Discussion of new case sizes, ratings, or products
Add 0603 and 7620-38 to EIA 535BAAC in next revision.
2.1.6 Global standardization of tantalum specifications
No action taken at this time.
2.1.7 High temperature (150C and up) applications for molded chip tantalums
Consider adding this to next revision of EIA 535BAAC.
2.1.8 Hazardous material (lead free, etc) considerations for tantalum chips
Lead free profiles should be added to the application guide.
2.1.9 Discussion of moisture sensitivity tests for SMD solid and polymer tantalums
No action taken at this time.

2.2 Review the EIA catalogue specification list. Review and update EIA list of "active working projects" -
This was done.....see action above.

2.3 MIL-PRF-55365: Proposed addition of temperature reflow screening
No action taken at this time.

2.4 Discussion on Niobium capacitors
Discussion will continue at all future meetings.

3.0 NEW BUSINESS

3.1 Any New business….All Members
New business was covered in the discussions above.

4.0 Next Meeting
The next meeting will be at the ECA Fall Engineering Summit Week of 7-10 October 2002 at Downtown Marriott in Charlotte, NC.

5.0 Adjournment
The meeting was adjourned at 2:00pm.

This session was conducted in accordance with the EIA Legal Guidelines and the Manual of Organization and Procedures.

Dave Richardson, Acting Chairperson
Signature on file

Dave Holmes, Acting Secretary
Signatures on file

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