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P-2.1 Committee on Ceramic and Dielectric Capacitors

Tuesday, October 9, 2001
4:15 pm - 6;15 pm
Loews Philadelphia Hotel
Philadelphia, PA

1.0 Membership and Attendance
1.1 Introductions- Circulate Membership Roster
1.2 Approval of Spring Meeting Minutes from San Antonio
1.3 Review of Agenda for Present Meeting
1.4 Correspondence & Review of Committee's Scope
1.5 Report of task groups, committees, and DSCC efforts
1.5.1. DSCC
1.5.2. ACH
1.5.3. Emerging Ceramic Products
1.5.4. U-1

2.0 Old Business
2.1 Status of EIA-595 (SP-4622) - Visual - Mechanical Guide
2.2 Status of Revision of EIA-469-D (PN-4621) -DPA
2.3 EIA-198-F Update
- Part I: Characteristics & Requirements -
- Part II: Test Methods (SP-4946) - ANSI Ballot Results to date (Voting period closes 4/23/2001)
- Part III: Individual Specifications
2.4 Review of IEC/EIA 521 (Application Guide for Ceramics) changes for temperature-voltage coefficient-Jim Canner/Dick Thompson
2.5 Status of chip dimension tolerance for Bulk Case-Corrections in 0603 Length to be added to part III of EIA 198
2.6 Status of ESL Capacitor test method-Jim Canner
2.7 Report from Working Group on RF current and measurement specifications.

3.0 New Business
3.1 Working Group Status Report

4.0 Time and Place of next meeting

5.0 Adjournment

P-2.1 Working Group Agenda for Monday, 10/8/2001 Meeting - 8 am to 4 pm

1.0 Adding Lower Voltages (10, 6.3, 4, 3.3, 2.5)
DF, TCC, VCC Life Test Voltage? (1X or 2X RV)?
2.0 Standard Capacitor values
3.0 0201 case sizes, mechanical, electrical
4.0 Maximum thickness in larger chip sizes. (1206 and higher)
5.0 Derating guidelines for ceramics. Review voltage-temp coefficient (VTC) VCC characteristics at 50% RV for example
6.0 Adding X5R chart to 198 sections 1 and 3. (probably TCC only)
7.0 10 uf and higher 100-120 Hz 0.5 volts
8.0 0508 low inductance 4-up array mechanical outline
9.0 Standards for RF current / power dissipation.
10.0 Power dissipation / max ripple current specs for std case sizes
11.0 High Frequency Characterization
12.0 Thickness Relaxation for Extended Values
13.0 Lead Free Soldering

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