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Minutes of P-2.1 Committee on Ceramic Dielectric Capacitors
October 9, 2001
Loews Hotel, Philadelphia, PA

1.0 Membership And Attendance

1.1 Introductions - Circulate Membership Roster

1.2 Approval of Previous Meeting Minutes
1.2.1 Minutes from the San Antonio spring 2001 meetings were approved.

1.3 Approval of Agenda
1.3.1 Agenda was approved

1.4 Correspondence & Review of Committee's Scope
1.4.1 There was no correspondence

1.5 Report on task groups, committees, and DSCC
1.5.1 DSCC
1.5.1.1 No report
1.5.2 ACH Committee
1.5.2.1 The ACH meeting was cancelled and has not been rescheduled as of this time.
1.5.3 Emerging Ceramic Products
1.5.3.1 See new business and working group topics
1.5.4 U-1 Committee
1.5.4.1 Report given by Dave Richardson - 2003 Fall Meeting is planned for Phoenix (Denver-Backup). In the future, members would like more complete agendas especially if technical presentations will be made (i.e., need speaker's name, company and title of presentation)

2.0 Old Business

2.1 Status of EIA-595-A (SP-4622), "Visual & Mechanical Inspection Multilayer Ceramic Chip Capacitors"
2.1.1 D. Thompson addressed comments from Mr. Garcia at the spring meeting in San Antonio, TX. Ed Mikoski of ECA will check on publication status.

2.2 Status Revision of EIA-469-D (PN-4621), "Standard Test Method for Destructive Physical Analysis (DPA) of Ceramic Monolithic Capacitors"
2.2.1 Ed Mikoski of ECA will check status.

2.3 EIA 198-F Update, "Ceramic Dielectric Capacitors Classes I, II, III, & IV"
2.3.1 Part I: Characteristics and Requirements Update
2.3.1.1 PN 4979 Assigned Aug 10, 2001. Mike Lauri is helping to edit this document.
2.3.2 Part II: Test Methods (SP-4946)
2.3.2.1 Mike Griffith is helping to edit this document. Ed Mikoski will check with C. Williams to see if any comments were received on last ballot (ANSI Voting period closed 4/23/2001).
2.3.3 Part III: Individual Specifications
2.3.3.1 Mike Cannon will request PN numbers for: Leaded, high voltage SMD, Low inductance SMD and standard voltage SMD so that changes and updates can be made.

2.4 Review of IEC/EIA 521, "Application Guide for Multilayer Ceramic Capacitors Electrical" changes for temperature-voltage coefficient - Dick Thompson
2.4.1 We will ask Mr. Thompson to try to get an electronic copy together for review by the working group at the next meeting.

2.5 Status of chip dimension tolerance for Bulk Case
2.5.1 Corrections in 0603 length to be added to part III of EIA 198 - 1.06 mm length should be changed to 1.60 mm.

2.6 Status of Low ESL test method.
2.6.1 Document is still in progress.

2.7 Report from Working Group on RF current and measurement specifications
2.7.1 Karun Malhotra of Murata made a technical presentation in the Working Group session. The committee discussed methods to move toward a standard method of measurement. The committee will invite Max Peel, Chris Reynolds, and possibly a representative from HP to discuss this further at the next working group meeting. A standard should be established (20 degrees C ??) for max heat rise for power dissipation specifications.

3.0 New Business:
3.1 Mike Cannon will obtain a PN for ceramic cap arrays so that work can begin on a specification.
3.2 It was suggested that for EIA 198, a template should be designed for each dielectric class that will be used to define the various characteristics of the common dielectrics in the class (example:X5R, X7R, X6S for class II). R. Bloodgett, C. Postiglione, and D. Ritchey agreed to look into this and propose a revision for table 1A, !B, and !C in 198 Section III/3.
3.3 A motion was made and seconded to align life test conditions in EIA 198 Section II with the IEC specification 60384-22 table 17 (Endurance Test Conditions). The motion passed with one abstaining (B. Friedman). Mike Cannon will talk to Mike Griffith about implementing this change.
3.4 A motion was made and seconded to change EIA-198 Section III/3, page 1. Such that the max thickness dimension does not exceed the maximum width. The motion passed.
3.5 A motion was made and seconded to add case sizes 0201, 2220 and 2225 to EIA 198 Section III/3 "Body Dimensions". The motion passed.
3.6 A motion was made and seconded that EIA 198 Section II (General Test Methods) Method 101 Table 1 be changed for cap measurement to conform with IEC 60384-22 section 4.1.7. This would call for capacitance values greater than 10 µF to be measured for cap value at 100-120 Hz, 0.5 volts +/-.2 volts with a referee voltage of +/-0.02 volts. The motion carried.

4.0 Working Group Status Report
4.1 The following agenda was agreed upon for the upcoming meetings in Albuquerque:
4.1.1 Standard Capacitor values...E series designations for values.
4.1.2 Derating guidelines for ceramics.
4.1.3 Adding Lower Voltages to the 198 Specification (10, 6.3, 4, 3.3, 2.5).
4.1.4 0508 low inductance 4-up array mechanical outline.
4.1.5 Standards for RF current / power dissipation.
4.1.6 Standards for power dissipation / max ripple and max allowed heat rise in standard packages and dielectrics (20 degrees C rise ??).
4.1.7 High Frequency Characterization.
4.1.8 Lead Free Soldering.
4.1.9 Pick roadmap topics. What areas should we be discussing / working on.
4.1.10 Discuss ESD issues.
4.1.11 Application Guide for Ceramics.

5.0 Next Meeting
5.1 The next meeting will be at the 4th ECA Engineering Summit the week of 14 April 2002 in Albuquerque, NM at the Sheraton Old Town Hotel.

6.0 Adjournment
6.1 The meeting was adjourned at 6:40 pm

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

Mike Cannon,
Chairman
Signature on file

Dave Richardson Secretary
Signature on file

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