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Minutes of P-2.1 Committee on Ceramic Dielectric Capacitors
October 2, 2000
Wyndham Hotel, San Diego, CA

1.0 Committee Organization and Procedures
1.1 Introductions / Membership / Attendance

Self-introductions were made, and the roster and sign-in sheets were circulated.
Attendance was taken, and it was determined that a quorum was present.

1.2 Approval of Spring Meeting Minutes from Arlington VA.

Motion carried approving the April 2000 minutes including changing item 2.3 from EIA-469-C to EIA-69-D.

1.3 Approval of Agenda

Agenda was approved.

1.4 Correspondence & Review of Committee's scope.

No correspondence. Mica capacitors need to be eliminated from committee scope.

1.5 Reports
1. DSCC report - Given by Mike Radacki. A copy is attached to the minutes.
2. ACH report - Given by Harold Peterson. ACH has worked on bulk case document. Comments have been received for bulk cassette case dimensions. Now included in recently published EIA-481.
3. U-1 Committee - The U-1 Committee meeting is scheduled for the next day Tuesday 10/3/2000.

2.0 Old Business
2.1 Status of Revision of EIA-595-A (PN-4622), "Visual & Mechanical Inspection Multilayer Ceramic Chip Capacitors," - Dick Thompson

Committee unanimously accepted draft at 4/2000 meeting. Latest draft has been located. It will be sent out for ballot shortly. Action Item

2.2 Status of Revision of EIA-469-D (PN-4621), "Standard Test Method for Destructive Physical Analysis (DPA) of Ceramic Monolithic Capacitors,"

The committee had previously voted to ballot a clean copy at the 10/99 meeting. Christine Pollack has a copy and will do a final review of the document and the photos, and then forward it to Michael Tinkleman, EIA to be balloted. Action Item

2.3 EIA-198-F Update, "Ceramic Dielectric Capacitors Classes I, II, III, & IV," - Jose Cruz

Currently broken out into three sections. The Committee unanimously agreed to SP ballot all of the sections of EIA-198 as soon as the revisions are completed. Action Item Harold Peterson will send a copy of bulk cassette dimensions to be inserted into EIA-198-F, section 3

Section 1 - Bernie Aronson is working on updated version from Mike Lauri. Needs a PN number. Action Item

Section 2 - Michael Griffith led a group to update section 2. Questions exist on reference to Mil Spec. DSCC has sent a letter to P-9 and will work with EIA to update the necessary Mil Specs. Michael Griffith will e-mail a copy to Michael Tinkleman.
Action Item

Section should be re-numbered with slash sheets. Need PN numbers for the 22 test methods. Action Item These test methods should be done separately but should all be released at the same time so they are known as a group.

Section 3 - Need PN's for bulk case, high voltage, capacitor array and low inductance test methods. These slash sheets need to be sent to Mike Cannon. Action Items

2.4 Review of EIA 521, "Application Guide for Multilayer Ceramic Capacitors - Electrical," need to add voltage characteristics. - Jim Canner / Dick Thompson

Michael Tinkleman, EIA provided Dick Thompson with a hard copy of EIA-521. Dick Thompson will bring a revised copy of EIA-521 to the P-2.1 working group's next meeting 4/2001 San Antonio for review, and to then be voted on in the 4/2001 P-2.1 committee meeting. Action Item

2.5 Status of chip dimension tolerance for Bulk Case - Harold Peterson

Harold Peterson will send a copy of bulk cassette dimensions to be inserted into EIA-198-F, section 3. Action Item

2.6 Status of ESL Capacitor test method-Jim Canner

HP/Agilent or equivalent, method should be adopted. Agilent will supply a test specification that they are developing with EIAJ. Mark St. Clair of Agilent will follow up and bring specification for review at next meeting. Action Item

3.0 New Business

Dave Richardson elected as secretary of P2.l committee.

3.1 Review of Documents

EIA-153-B, "Molded and Dipped Mica Capacitors (Wire Lead Styles)

The maintaining of an industry standard for Mica was discussed. (EIA 153).
The specification has not been rescinded. Laird Macomber will review the specification for any needed updates. A recommendation will be presented by Laird to move the responsibility for this specification to the P-2.2 Films Committee. Michael Tinkleman will send a copy of EIA-153 to Laird Macomber. Action Item

3.2 P-2.1 Working Group Meeting Summary

1. Adding Lower voltages below 6.3 volts. Where are we going? What should standard voltages be? Task Force - Harold Peterson, Dave Ritchey, Dick Thompson, Andrew Szabo, Mike Cannon & Chris Reynolds.

2. Adding 0201 Size - Mechanical / Electrical - Task Force - Dave Ritchey, Harold Peterson, Dick Thompson, Chris Reynolds, AVX Canner

3. Standard Capacitor Values for 10 uf and above (SMD MLC) for EIA-198.
Mike Cannon, Ritchey, Peterson, Thompson

4. Derating Guidelines (Temperature / Voltage) especially lower voltage DC and for AC applications 50% applied voltage minimum number - in section III slash sheet.
Peterson, Thompson, Cannon, Ritchie, Szabo

5. Review Max Thickness for 1206 and larger in 198 Table
Comments for 521 Application Guide
Peterson, Thompson, Cannon, Ritchie, Szabo

6. Add X5R to section 3. - All

7. Test Voltages / Frequencies for measurements EIAJ 2324
Pollock, Canner, Thompson, Richey, Peterson

8. 4 Element 0508 Array - Low Inductance - Dimensions, ratings,
Reynolds, Ritchie, Cannon, Thompson, Peterson

3.3 P-2.1 Working Group Agenda for 4/2001 Meeting
1. Adding Lower Voltages (10, 6.3, 4, 3.3, 2.5)
DF, TCC, VCC
2. Standard Capacitor values
3. 0201 case sizes, mechanical, electrical
4. Maximum thickness in larger chip sizes. (1206 and higher)
5. Derating guidelines for ceramics. Review voltage-temp coefficient (VTC) VCC characteristics at 50% RV for example
6. Adding X5R chart to 198 sections 1 and 3. (probably TCC only)
7. 10 uf and higher 100-120 Hz 0.5 volts
8. 0508 low inductance 4-up array mechanical outline

4.0 Time and Place of next meeting

The next meeting will be at the 2nd Engineering Summit 4/23-25/2001 in San Antonio.

5.0 Adjournment

The Committee moved, seconded, and unanimously agreed to adjourn at 5:58 PM.

8.0 Action Items

EIA-595-A (PN-4622), "Visual & Mechanical Inspection Multilayer Ceramic Chip Capacitors," - to be sent out for ballot shortly.

EIA-469-D (PN-4621), "Standard Test Method for Destructive Physical Analysis (DPA) of Ceramic Monolithic Capacitors," - revised copy from Christine Pollack to be balloted.

EIA-198-F Update, "Ceramic Dielectric Capacitors Classes I, II, III, & IV," - Jose Cruz. The Committee unanimously agreed to SP ballot all of the sections of EIA-198 as soon as the revisions are completed.
Section 1 - Needs a PN number.
Section 2 - Michael Griffith will e-mail a revised copy to Michael Tinkleman.
Need PN numbers for the 22 test methods
Section 3 - Need PN's for bulk case, high voltage, capacitor array and low inductance test methods. Send slash sheet to Mike Cannon.

EIA 521, "Application Guide for Multilayer Ceramic Capacitors - Electrical,"
Dick Thompson will bring a revised copy of EIA-521 to the P-2.1 working group's next meeting 4/2001 San Antonio for review, and to then be voted on in the 4/2001 P-2.1 committee meeting.

Chip dimension tolerance for Bulk Case - Harold Peterson will send a copy of bulk cassette dimensions to be inserted into EIA-198-F, section 3.

ESL Capacitor test method - Mark St. Clair of Agilent will bring specification for review for next meeting.

EIA-153-B, "Molded and Dipped Mica Capacitors (Wire Lead Styles) - Michael Tinkleman will send a copy of EIA-153 to Laird Macomber.

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

Mike Cannon,Chairman
Signature on file

Dave Richardson/Michael Tinkleman, Secretary
Signature on file

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