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Home > Technology Center > Engineering Committees > P-1 Committee Minutes
of P-1 Committee on Resistive Devices
1
Committee organization and procedures Self-introductions were made, attendance taken, and it was determined that a quorum was present. 1.2 Approval of the Agenda The Committee unanimously accepted the Agenda as presented. 1.3 Approval of the Minutes The Committee unanimously accepted the Minutes of the last meeting as with changes to voting members as follows: - Piscitelli absent; Friedman replaced by Domingo Pichardo; Froutan present; Krystek voting member; and Ritchey voting member 1.4 Correspondence No correspondence
was received. No review was required. 1.6 Report of task groups and DSCC efforts DSCC
supplied report of status of Mil specs and drawings. DSCC report is
attached. Motion was made to approve PN-4547 with the following changes - add the following reference specifications to Section 2 "Applicable Documents" - EIA-481, "Taping of Surface Mount Components for Automatic Handling;" EIA 541, "Packaging Materials for ESD Sensitive Items;" and EIA 556-B, "Electronic Industries Association: Outer Shipping Container Bar Code Label Standard." Specification was unanimously approved with the above changes to be added. Brian Piscitelli to make changes and forwarded changed and finalized copy to Michael Tinkleman. Action Item 2.2 Review of PN-4548, "Thin Film Resistor Network Specification" Motion was made to approve PN-4548 with the following changes - add the following reference specifications to Section 2 "Applicable Documents" - EIA-481, "Taping of Surface Mount Components for Automatic Handling;" EIA 541, "Packaging Materials for ESD Sensitive Items;" and EIA 556-B, "Electronic Industries Association: Outer Shipping Container Bar Code Label Standard." Specification was unanimously approved with the above changes to be added. Brian Piscitelli to make changes and forwarded changed and finalized copy to Michael Tinkleman. Action Item 2.3 ESD recommendations for thick film resistors Mr. Ritchey provided data on cost of packaging thick film resistors with ESD type materials. ACTION ITEMS: 2.3 Lead Free issue No new business 2.4 Bulk Feeders - Many OEM's have
moved manufacturing to CEM's. Industry to wait for information from
CEM's regarding requiring additional information. 3.1 Possible Test Standards for Flex Circuits. Brian Piscitelli discussed testing for flex circuits. Brian Piscitelli will check with manufacturers regarding Flex circuit issues, and try to get them to attend a future P-1 committee meeting. Action Item 3.2 Lead free
issue on variable resistors The next meeting
will be at the 2nd Engineering Summit 4/23-25/2001 in San Antonio. 5 Adjournment The Committee moved, seconded, and unanimously agreed to adjourn at 3:05PM. 6 Action items PN-4547 & PN-4548, Brian Piscitelli to make changes approved by committee, and forwarded changed and finalized copies to Michael Tinkleman. ESD Data - Mr. Ritchey to provide additional ESD data. ESD data to be added to the meeting minutes and to the ECA website. Marie Slezak, Kamaya, and other components suppliers to provide additional components for testing. ESD Data to be potentially submitted to the next CARTS meeting. Bulk Feeding - Mike Griffith will report on the status of activities from the IPC meeting. Flex circuit issues - Brian Piscitelli will check with manufacturers, and try to get them to attend a future P-1 committee meeting. VRI meeting - Brian Piscitelli will send a letter to them to try and get a response, and to get someone to attend the next P-1 committee meeting. This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures. Brian Piscitelli,
Chairperson Michael Griffith/Michael
Tinkleman, Secretary
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