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Minutes of U-1 Passive Components Steering Committee
October 9, 2001
Loews Hotel, Philadelphia, PA

1.0 Committee organization and procedures

1.1 Membership and attendance
Self-introductions were made, attendance taken, and it was determined that a quorum was present. The Chair bid a special 'Thank you and farewell' to Caddy Greenidge of Vishay for his many years of contributions to the many activities within the passive component standardization efforts at EIA and ECA. Ed Mikoski was introduced as the new EIA liaison for the group.

1.2 Approval of the Agenda
Motion to approve the agenda for today's meeting with the addition of a report from P-1 Resistive Devices Committee. Agenda was approved as modified.

1.3 Approval of the Minutes
Minutes of the April 2001 U-1 minutes from San Antonio, TX were unanimously approved.

1.4 Correspondence
No correspondence was received.

1.5 Technology Roadmapping
A presentation was delivered by Mr. Ron Gedney, Vice President, Operations at the National Electronics Manufacturing Initiative (NEMI). Mr. Gedney spoke about the Technology Roadmap that NEMI publishes, and how it is developed in cooperation with other organizations. The presentation was delivered from the viewpoint of an OEM. The concept of roadmapping is considered a valuable strategic planning tool by many organizations.

A copy of the presentation will be placed on the committee website.

The U-1 committee agreed that this is something that should require more attention by the committees during the conference. Each of the passive component committees should begin to develop an agenda item dealing with a technology roadmap for their respective passive components. It was generally agreed that presentations properly announced in the preliminary agendas would be a good draw for attendance by both manufacturers and OEMs. Information gathered from these activities would eventually become a valuable feeder to the NEMI Technology Roadmap Revisions in the area of passive components.

The committee wishes to thank Mr. Gedney for his contribution and welcomes him back to develop the concept of the Technology Roadmap.

1.6 Subcommittee and Working Group Reports
P-1.0 Resistive Devices - Brian Piscotelli reported for the committee. The resistor committee met during the previous day. The present work of the committee is 95% complete. A White Paper on the ESD sensitivity of Chip Resistors was delivered and will be posted on the website.
P-2.1 Ceramic Capacitors. Mike Cannon gave a report on the Ceramic Working Group meeting. A considerable amount of the documentation in the 198 standard is in various stages of revision. The committee will be looking at proposed changes for cap measurement frequencies and voltages, and life test conditions for lower voltage ratings. These are similar to the IEC requirements and will be considered for incorporation into EIA198. The group discussed power dissipation for RF/microwave for multi-layer ceramics. Karun Malhotra delivered a presentation on the subject. Carl Postiglione also delivered a presentation on A.C. ratings on ceramic capacitors for power applications.
P-2.2 Plastic and Film Capacitors. Michael Mosier reported for the committee. Small Chip and small film capacitors are mostly now being manufactured off shore. The soldering profile on film chip capacitors is a problem to be worked on. The committee is working on specifications for surface mount film capacitors.
P-2.4 Aluminum Capacitors. Michael Mosier reported for committee. Large manufacturers are active in this committee, but a couple of them have not attended this week of meetings. The surface mount electrolytic specification is on the website for review. The group also is to review technical information from the AEC Q200 Automotive specification. The surface mount aluminum qualification specification is on the web for comment.
P-2.5 Tantalum and Niobium Capacitors Committee. Dave Richardson reported that draft specifications for polymer cathode, 150ºC, moisture sensitivity, and niobium capacitors are a few of the topics that are under discussion. Qualification specifications and part description tests are being prepared for powder tantalums and the group will talk about niobium capacitors, a more abundant metal than tantalum.
P-3.0 The group will be discussing PN 4233 and PN 4213 covering Surface Mount Inductors. It is also planned that the group will be considering another specification covering Ceramic Bead Inductors.
P-4.0 Mechanical Outlines - PDP-100. Caddy Greenidge reported for the committee. PDP-100 has been in existence for about 20 years. Significant changes took place at the meeting. The committee agreed to change the coding of the outlines. The SO category is now removed so all the registrations will become commodity type specifications. The fourth character, normally an indicator of M, C, or N, will have an additional one as a code for inch-pound units. Therefore the outline currently referring to a standard case size of 3216 will be referred to as 1206, which is the conventional term used in the industry for this size component. The committee to reflect this new approach also modified the scope statement. Brian Piscitelli became the new Chairman of the committee and Diane Bicknese became the new Vice-Chair.
P-9.0 Test Methods - Michael Mosier reported for the committee. The 186 Standard needs to be updated. All old technical specifications call out this document. It is close in requirements to the MIL-STD 202 series. The Defense Supply Center Columbus is in the process of attempting to upgrade the 202 documents.
P-10.0 Mike Griffith reported. This group is working on a Chip Scale Qualification Documents. They also expect to register more components to the Integrated Passive Device program.
P-14 The Over-current Protection Devices committee is preparing Surge Fuse documents.
G-11 No Report
DSCC No Report

2.0 Old Business

2.1 ECA Web Site Update
Ed Mikoski informed the committee that he and Mr. Bob Willis, President of ECA would be speaking at the Dinner Session. The subject will address e-Business-to-Business and Web Conferencing. The program for web conferencing for the ECA Engineering Committees will be demonstrated and what is available to work with at the ECA website. Ed asked how many of the committee had recently been into the website, and most everyone had. There is a wealth of information at the site, and it is constantly being updated and improved.

3.0 New Business

1.7 Environmental Update
Heather Bowman, Manager, EIA Environmental Programs is scheduled to speak at the luncheon after the U-1 Committee meeting. She will deliver an update on the present environmental activities and initiatives within the Alliance.

4.0 Future Meetings
A. Jennifer Watson, from the EIA, covered meeting schedule and location topics.
B. The schedule for next meeting will be rotated, but will follow same core schedule.
C. Spring 2002 meeting - Week of 14 April 2002 at the Sheraton Old Town Hotel in Albuquerque, NM.
D. Fall 2002 meeting - Charlotte, NC area.
E. Spring 2003 - Phoenix, AZ area with a backup city of Denver, CO.
F. A discussion pursued on how to build on the momentum that exists within the week of meetings and administrative items related to this.
a. Note was made to continue to rotate the sequence of the committee meetings after each summit.
b. The electronic registration process is an improvement, but there were several suggestions. It would be more desirous to have one registration page with blocks to check for attendance at all of the scheduled meetings. This would allow for more accurate determination of space requirements and reduce confusion of registration.
c. It was felt that a coordinated effort to identify any papers being delivered and having those clearly identified would attract more users to the meetings.
d. The emphasis on a technology roadmap portion to each of the sessions would also attract more companies.
e. It was noted that the center of manufacturing is transferring from the traditional OEM customer to that of the contract manufacturers. An effort should be made to get some of them to the meetings.
f. Explore linking with RosettaNet for Passive Standards.

5.0 Adjournment
The meeting was adjourned at 10:10 AM.

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

Dave Richardson, Acting Chairman
Signature on file

Dave Holmes, Acting Secretary
Signatures on file

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