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Minutes of U-1 Passive Components Steering Committee
April 24, 2001
Hyatt Regency, San Antonio, TX

1 Committee organization and procedures

1.1 Membership and attendance

Self-introductions were made, attendance taken, and it was determined that a quorum was present.

1.2 Approval of the Agenda

Motion to approve the agenda for today's meeting. Agenda approved.

1.3 Approval of the Minutes

Motion to approve October 2000 U-1 minutes from San Diego. Seconded. Motion carried unanimously to approve minutes.

1.4 Correspondence

No correspondence was received.

1.5 Review of Committee's Scope

No review of committee scope needed.

1.6 Subcommittee and Working Group Reports

P-10 - Mike Griffith gave P-10 IPD committee report. They approved an RC test specification, and, the committee is also looking at registrations for new packages.
P-14 - Dianne Bicknese- Cooper Bussman gave fuse report. Two standards just completed an ANSI ballot. Results to be discussed at the meeting.
G-11 - No Report
P-2.5 - Tantalum and Niobium Dave Toomey - Draft specification for polymer cathode, 150C, and moisture sensitivity are a few of the topics to be discussed in the P-2.5 meetings.
P-2.1 - Dave Richardson gave report on Ceramic working group meeting which included working on EIA-198 part II, and looking at smaller case sizes such as 0201.
PDP-100 Caddy Greenidge - Caddy edited the PDP-100 document and put it on web for comments. No responses were received. Caddy is not sure if there is a need for registrations. However, a standard format methodology may be determined in committee. PDP-100 would then be changed into a document on "how to create a document". The actual final documents would be generated and finalized in the appropriate engineering committees.

P2.2, P2.4, P-9 - Cecil Van Arsdale - A number of specifications will be discussed and acted on at the committee meetings in preparation for ballots.

P-1 Resistors - Brian Piscitelli - EIA 886 and 887 for thick and thin film chips published. The committee will publish a white paper on sensitivity to ESD.

1.6 Luncheon Speech Preview

Heather Bowman gave a preview of her talk scheduled for the lunch hour on environmental issues that will be affecting the electronics industry.

Copies of the recently published EIA Materials Declaration Template were handed out.

2.0 Old Business
2.1 ECA Web Site Update

Michael Tinkleman gave a presentation on the new ECA web site update discussing some of the new features and future directions. There is a link under the U-1 Committee to the AEC Automotive Passive Component Qualification specification, as requested at the San Diego U-1 meeting. Some of the committee members had questions on electronic balloting, which is currently used in other EIA sectors.

3.0 New Business

EIA Update

Edward Mikowski, Vice President Standards and Technology, EIA gave an update on the current EIA Organization; the key EIA industry committees such as the Environmental Issues Council; the changes going on in the electronics industry; potential impacts of emerging technologies; and the roles of the new EIA Technology Council (ETC).

3.1 Lead-Free Roundtable Discussion - copies of the NEMI and AVX presentations are on the ECA web site.

- NEMI Lead Free Activity by Richard Parker, Component Team Leader from Delphi Automotive. The presentation was entitled "Lead Free Component Team Status." Richard conducted the presentation by telecom hook-up. (His phone number is 765-451-8040). Any member is welcome to call him with any questions or comments on his presentation.

Chris Reynolds from AVX gave a presentation entitled, "Lead Free ...A Passive Manufacturer's Perspective."

Keith Seamands recommended that we invite PC board manufacturers for the next meeting to discuss the impact of no lead / high temperature. He also suggested that we should continue to focus on lead free and high temperature topics. Action Items

Heather Bowman will notify the attendees of the EIC (Environmental Issues Council) membership of the EIA/ECA so that member companies may contact their company's EIC members for further questions, comments and possible participation. Action Item

Dick Thompson - Reported on lead issues for ceramics.

Nancy Reynolds - Reported that lead free lead frames are no problem but that performance of the tantalum chips at higher reflow temperature needs more study.
See Shipley Ronal web site for a good discussion of tin whiskering. If nickel barrier is present, tin whiskers are eliminated.

Harold Peterson - indicated that trace amounts of lead are still involved in dielectric and
termination glass frit, but for the most part, lead will be eliminated (in larger quantities) by the end of the year.

Mike Lauri - Gave a report on IBM's efforts to eliminate/reduce lead.

4.0 Future Meetings

Brie Potash from the ECA covered the meeting schedule and location topics. The Fall Engineering Summit is scheduled for Philadelphia on October 8-10, 2001 at the new Loews Hotel in Center City. The ACH meeting will follow on October 11-12, 2001. Also, the Soldering Technology Committee will be participating in the Engineering Summit for the first time.

The schedule for next meeting will be the same as in San Antonio with the rotation of the P-4 Committee meeting from last on the agenda to first on the agenda. Also, at the request of the P-2.1 chairman, the P-2.1 meeting in Philadelphia will be from 4:15 - 6:15 PM on Tuesday with the option of an additional hour of discussions - up to 7:15 PM if needed. (The Tuesday dinner starts at 7:30 PM.) Also, the P-9 meeting will start at 2:15PM on Wednesday.

Philadelphia Fall Engineering Summit Schedule 10/8-10/2001

Albuquerque and Charlotte were chosen as locations for the 2002 meetings with Albuquerque for the Spring, and Charlotte for the Fall.

The Committee chairman thanked ECA and EIA staff for doing such an exceptional job at the San Antonio meetings.

5.0 Adjournment

The Committee moved, seconded, and unanimously agreed to adjourn at 10:12AM.

6.0 Action Items

· Organize a follow-up Lead Free Roundtable for the Fall Summit meeting.

· Invite PC board manufacturers and other users to the Fall Summit meeting.

· Heather Bowman, EIA to provide committee members with a listing of the EIA Environmental Issues Council (EIC) committee membership. This will allow them to identify their company's EIC point of contact.

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.



Keith Seamands, Chairperson
Signature on file

Dave Richardson/Michael Tinkleman, Secretary
Signatures on file

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