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Home > Technology Center > Engineering Committees > STC Committee > Minutes Minutes
of the Joint Soldering Technology Committee (STC)
1 Committee organization and procedures 1.1 Membership and attendance Self-introductions were made, attendance taken, and it was determined that a quorum was not present. 1.2 Approval of the Agenda The Committee unanimously accepted the Agenda as presented. 1.3 Approval of the Minutes The Committee unanimously accepted the Minutes of the last meeting as written. 1.4 Review of the Committee's scope The committee scope was reviewed. 2 Old business 2.1 Review/status of ANSI J/STD-001-C ANSI J/STD-001-C was published March 2000. A number of inquiries suggestions for improvement to the J Std-001 have been submitted to IPC and a new revision activity on the J Std-001 will likely be opened at the November IPC meeting in New Orleans. 2.2 Review of
ANSI J/STD-002-B Mr. Kwoka gave a brief description of how the various JEDEC committee's interact and how JEDEC and DSCC interact in order to produce Military specifications Mil Std 883 and Mil Std 750. Also some discussion of the JEDEC balloting and approval process was given. 2.2.2 J STD-002B Status J STD-002B has completed balloting with ZERO no votes. Some comments were received and have been dispositioned at the September JEDEC meeting. These comments were reviewed at the STC meeting and ready for presentation at the IPC meeting in November. Upon review at IPC, the comments will be included into the final version of the J Std-002B and submitted to te JEDEC Board of Directrors for approval. Since there were ZERO no votes, we expect the document to be approved "by acclamation". IPC is leading this activity . We anticipate the publishing of the new J Std-002B in January 2003. 2.2.3 JEDEC
Participation and Adoption of ANSI J STD-002B 2.3 Lead-free testing and evaluations 2.3.1 NEMI Whisker Test Method Group Mr. Kwoka gave a short presentation on the status of the NEMI Whisker Test Method Task Group. Their goal is to prepare a test method to assess the whisker formation tendency of various materials. This group will present Phase 2 results at the IPC meeting in New Orleans. The report showed that in Phase 2 there was some whisker growth on new selected copper lead frame IC samples. The Phase 1 samples did not show any whisker growth and this was confirmed in Phase 2 testing. Also, the samples that can grow whiskers in the largest density were the passive chip capacitors. The longest whiskers were obtained on bright tin over brass. The finished report for Phase 2 should be available at the April '03 IPC meeting. 2.3.2 NEMI Whisker
Fundamentals Task Group 3 New business 3.1 Elect a New Chairman Mr. Doug Romm from Texas Instruments has been unanimously elected as the new Soldering Technology Committee Chairman. Mr. Romm has been a member of the STC for many years and will provide excellent leadership to the group. Mr Kwoka steps down after a 14-year tenure as chairman 4 Next meeting The next meeting is tentatively planned for 14 -17 April 2003 in Tempe , Arizona. Ms. Williams will forward the meeting notice. ACTION ITEM C. Williams to distribute meeting announcement. 5 Adjournment The Committee moved, seconded, and unanimously agreed to adjourn at 5:00PM. This meeting was
conducted in accordance with the EIA legal guidelines and the EIA manual
of organization and procedure.
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