Home > Technology Center > Engineering Committees > STC Committee > Minutes

Minutes of the Joint ECA Soldering Technology Committee (STC), IPC 5-23b,
and JEDEC JC13 TG9901 Committee Meeting

Tuesday, 9 October 2001 Loews Hotel, Philadelphia, PA
Wednesday, 10 October 2001 Rosen, Center Hotel, Orlando, FL

Chairman: Mark Kwoka

1 Committee organization and procedures
1.1 Membership and attendance
Self-introductions were made, attendance taken, and it was determined that a quorum was not present.

1.2 Approval of the Agenda
The Committee unanimously accepted the Agenda as presented.

1.3 Approval of the Minutes
The Committee unanimously accepted the Minutes of the last meeting as written.

1.4 Review of the Committee's scope
No review was needed.

2 Old business
2.1 Review/status of ANSI J/STD-001-C
ANSI J/STD-001-C was published March 2000 and there has been no revision activity started yet.

2.2 Review of ANSI J/STD-002-B

2.2.1 "Active wetting" results on new samples
At the Orlando meeting, Dave Hillman informed the group that all of the split lot components that were assembled onto circuit boars at Rockwell have passed the Class 3 Requirements of J Std-001C.
The results have been added to the chart below.

ZERO HOUR STEAM AGE Solderability Test Results

EIGHT HOUR STEAM AGE Solderability Test Results

A discussion of these data ensued. These final board level assembly results show that both of the dip and look solderability test requirements are over rejecting marginal components when 8 hr steam preconditioning is applied prior to the dip and look test.. None of these components failed J Std-001C Class 3 requirements at the board level. The ROL0 flux data do show that it is likely that more reject leads on rejected units would be obtained using the active wetting requirements. However, there is no difference in the overall conclusions reached using either the active wetting or current J Std-002A requirements. Both tests over reject marginal product. The ROL1 data (Actiec 2) indicates no difference in the overall conclusions reached using either the active wetting or current J-STD-002A requirements on all package styles except the 8 hour steam aged, 3 lead TO-220 cell. With the board level assembly referee now complete, the group felt that the active wetting proposal does not offer any increased accuracy, reduced test variation or increased ease of use of the J Std-002 test method and this activity will be dropped.

2.2.2. Current Data Summary Supporting Change to Actiec 2 Flux
1) Analysis of wetting balance data comparing Actiec 2 with R flux from Fall '99 and Spring '00 showed less wetting balance parameter variation with the Actiec 2 flux compared to R flux.

2) George Wenger 4 lead tabs exhibited poor solderability and were rejected during solderability testing using both R and Actiec 2 flux . The proposed Actiec 2 flux did not allow the poor soldering shields to pass the dip and look test.

3) NIST metal shield data which exhibited a range of active wetting, all failed the dip and look test using either R or Actiec 2 or Actiec 5 fluxes. Again poor soldering shields did not pass the solderability test using the Actiec 2 flux.

4) IPC/STC/JEDEC Joint Test Plan underway.

2.2.3 IPC 5-23b/ EIA - STC/ JEDEC JC 13 TG9901 Joint Test Plan
Mr. Kwoka briefly reviewed the Joint Test Plan which has been agreed to between the IPC 5-23b, EIA STC and the JEDEC JC 13 TG9901. The test plan is being run to validate and determine choices of Solder Dwell Time(3 sec vs 5 sec), Solder Test Flux (R vs Actiec 2) and Solder Test Temperature ( 235 vs 245 C).
Experimental units used for this study are "marginal" 44ld MQFP, 8ld SOIC, 14ld CERDIP, 14ld PDIP, 2 ld Chip Caps. The testers participating in the study are Kon Lin, Dave Hillman, George Wenger, Kil-Won Moon/Maureen Williams, and Greg Wood. Greg wood of ACI presented his results which have been included in the table below. All three testers have now completed their evaluations. In Addition, at the Orlando meeting Dave Hillman informed the group that all of the split lot components that were assembled onto circuit boards passed J Std-001C Class 3 requirements. All cells had some failures. We will now execute the data analysis before drawing any conclusions.
ACTION ITEM: Mr. Kwoka to contact Bill Russell and send the finished test plan to Mr. Russell for analysis. Mr. Russell to complete the analysis for presentation at the next meeting.

2.2.4 Soldering Iron Test
Mr. Hillman conducted a poll on TechNet and had four respondents. One out of four indicted they still used the soldering iron test. Mr. Singleton responded via email that his company uses the test. The group agreed to consider a draft proposal of the test method based on the IEC and Mil-Std documents.

ACTION ITEM: Mr. Hillman to draft a straw-man solder iron test method for the next meeting.

2.3 Lead-free testing and requirements and STC role/responsibilities

2.3.1 Lead Free Trends
Mr. Kwoka discussed some of the lead free efforts that are currently underway in the industry. NEMI
Is currently investigating lead free alternative solders and also has an active whisker test task group working on a whisker test method for use to determine the propensity of a sample/component to form whiskers. Also, the Lead Free Component Focus Group has just completed it's evaluation of 4 component finishes across 3 circuit board finishes and using 3 solder alloys. These results were presented at the IPC Fall Conference in Orlando, FL. Despite much discussion about lead free, to date there has not been much demand for lead free component termination finish.

2.4 JEDEC Revision of Mil STD883/2003, Mil Std750/2026 and participation in ANSI J/STD-002-B
revision
Mr. Kwoka discussed the results of a "survey" of the JEDEC JC 13 regarding a proposal of changing the J Std-002A as follows:

Solder Immersion Time : From 5 seconds TO 3 seconds
Flux : From ROL0 TO ROL1 (Actiec 2)

This survey was on the JEDEC electronic voting machine. A total of 20 responses were received. 9 respondents indicated that they would accept these proposed changes if this were a ballot. 6 respondents offered editorial changes and 5 respondents said they would reject the proposal. The reasons for the 5 rejections were as follows:
1) Unknown impact on already tested finished goods. Retesting required.
2) Changes would require more testing, tighter criteria, increased test equipment capability.
3) Chloride activator is radical addition to flux and may let marginally bad parts pass test. The term "colophony" is not well defined.
4) 3 sec immersion time is too fast and will not allow complete dissolution of some commonly used termination finishes like palladium.
5) 235C is too cold to show internal reflow problems associated with some complex components.

Dave Hillman has checked BADER's charts and it does appear that 3 seconds may not be sufficient time for NiPd dissolution and that 5 seconds may be a more robust condition. We will check into the other four assertions, achieve consensus and respond to each commenter. Mr. Kwoka also reiterated that the JEDEC people have been very cooperative and are working in good faith to review the J Std-002 and adopt as much as possible the J Std-002 into the Mil Std 883 TM 2003 and the Mil Std 750 TM 2026.

ACTION ITEM: Mr. Hillman to clarify the "type of colophony" used in the manufacture of Actiec 2 and also determine if Actiec 2 is a trademark.

3 New business

3.1 Liason with P-9 Committee
Mr Skidmore, chairman of the ECA P-9 Test Methods Committee for Passives inquired whether the STC would be the natural place for specifications concerning resistance to soldering heat and dissolution of metalization. The STC would be the natural place for such specifications. The P-9 Committee administers documents in the " TM - 186 series ", some of which contain test methods for soldering related activities. Mr. Skidmore will discuss this further with the P-9 committee.

3.2 ECA liason with JEDEC and IPC regarding J-Std-002
Mr Mikoski inquired about how the STC operates and where we perceive the "home" of the STC resides. The STC is an ECA committee and resides in the ECA. However, over the years, the work being done by both the STC and the IPC 5-23b committee has overlapped significantly. Testing evaluations are, and were, conducted by members of both committees' that were involved in drafting the Joint Standard J Std-002. The IPC has taken the lead in the publishing logistics of the J Std-002. It became more convenient and cost effective to mutually agree to meet at a single location and conduct joint meetings. We chose to convene at the IPC since the 5-23b committee would also meet during a larger IPC conference/show and this would improve attendance. While more convenient for active STC members, this practice has made it difficult for other ECA members to participate in the Soldering Technology Committee activities. As a result, we will stagger our bi annual meeting venues. One meeting will occur jointly with IPC and one meeting will occur with the ECA.

Mr. Mikoski also inquired about the Memorandum of Understanding with the IPC regarding publication, distribution, website posting and royalties associated with the J Std-002.

ACTION ITEM: Mr. Kwoka agreed to put Mr. Mikoski in touch with Jack Crawford and Dave Bergman of the IPC as well as with Ingrid Taylor at JEDEC so they can discuss and resolve this issue.

At the Orlando meeting, Dave Bergman of IPC mentioned that the IPC has an understanding with JEDEC.
The IPC would prefer that ECA and JEDEC first discuss and resolve issues associated with the J Std-002 before discussing same with IPC.

4 Selection of next meetings
The next meeting will be on 16 April 2002 in Albuquerque, NM at the ECA meeting from 1-5 pm.
Ms. Williams will forward the meeting notice.
ACTION ITEM¾C.Williams to make meeting arrangements and distribute.

5 Adjournment
The Committee moved, seconded, and unanimously agreed to adjourn at 4:00PM.

6 Action items
· Mr. Kwoka to contact Bill Russell and send the finished test plan to Mr. Russell for analysis.
· Mr. Russell to complete the analysis for presentation at the next meeting.
· Mr. Hillman to draft a straw-man solder iron test method for the next meeting
· Mr. Hillman to clarify the "type of colophony" used in the manufacture of Actiec 2 and also determine if Actiec 2 is a trademark.
· Mr. Kwoka agreed to put Mr. Mikoski in touch with Jack Crawford and Dave Bergman of the IPC as well as with Ingrid Taylor at JEDEC so they can discuss and resolve this issue.
· C.Williams to make meeting arrangements and distribute.

This meeting was conducted in accordance with the EIA legal guidelines and the EIA manual of organization and procedure.

This meeting was conducted in accordance with the EIA legal guidelines and the EIA manual of organization and procedure.

Mark Kwoka, Chairperson
Signature on file

Return to STC Main