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Home > Technology Center > Engineering Committees > STC Committee > Minutes Minutes
of the Joint Soldering Technology Committee (STC) and the
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Committee organization and procedures Self-introductions were made, attendance taken, and it was determined that a quorum was present. 1.2 Approval of the Agenda The Committee unanimously accepted the Agenda as presented. 1.3 Approval of the Minutes The Committee unanimously accepted the Minutes of the last meeting as written. 1.4 Correspondence A letter of introduction was reviewed which stated that Bernie Aronson had retired from EIA in May 2000 and is working as a consultant to ECA( Electronic Components, Assemblies and Materials Association). Michael Tinkleman, Ph.D., has replaced Bernie as our liaison and Manager of ECA Engineering Services. Mr. Kwoka reviewed a lead free communication from Bill Carrier at Mallory North American Capacitor Company. Of interest was the AEA-EIA Joint Principles on Proposed European Waste and Substance Restriction Directives. The AEA and EIA support advancing the goals of the EC's proposed Waste Directive to increase recycling and conserve resources and minimize lifecycle impacts of electronic products. However the AEA and EIA are concerned with certain aspects of the directives to attain shared goals. The AEA and EIA oppose the proposed ban by 2008 on several essential materials such as lead because it is not based on any scientific finding that targeted materials pose environmental risks when used in electronics. Also, there has been no analysis of the environmental impacts of replacement materials. Also a communication from the WTO Committee on Technical Barriers to Trade was reviewed. 1.5 Review of the Committee's scope No review was needed. 2
Old business ANSI J/STD-001-C was published March 2000 and there has been no revision activity started yet. 2.2 Status of EIA-654-C, Resistance to soldering heat EIA -654 was approved by ANSI on 8/16/00 and has been sent to Global for distribution. This is finally complete. 2.3 Review of ANSI J/STD-002-B 2.3.1 "Active wetting" results on new samples Mr. Lin and Mr Wenger presented their data on the active wetting evaluation which are included in the chart below. Mr. Wengers' complete report is attached (PDF). ZERO HOUR STEAM AGE Solderability Test Results EIGHT HOUR STEAM AGE Solderability Test Results
A discussion of these data ensued. These data do show that it is likely that more reject leads on reject units are detected using the active wetting requirements. However, there is no difference in the overall conclusions reached using either the active wetting or current J Std-002A requirements. As a result there is no added capability or test accuracy or precision offered by this proposal. It was pointed out that these data were taken using type ROL0 flux(Type R) and that we are considering adopting the ROL1( Actiec 2) flux into the standard. Perhaps the use of Actiec 2 flux may result in added discriminating ability of the active wetting proposal. Since the NIST data set was not yet complete, the group felt another round of experimentation using the Actiec 2 flux would allow a resolution of this evaluation. ACTION ITEM: Mr. Kwoka to send new samples to Mssr. Wenger, Lin and Wood along with a new test plan. Mr. Moon and Ms. Williams will simply use the Actiec 2 flux instead of type R flux for the samples they already have. 2.3.2 New Data for R vs Actiec 2 and Active Wetting using Wenger Shields Mr. Moon and Ms. Williams had completed the active wetting sample evaluation using metal shields provided by G. Wenger. It was anticipated that these shields would exhibit marginal solderability and be good samples to compare the Actiec 2, Actiec 5 and R flux as well as illustrate the utility of the proposed active wetting requirement. Ms. Williams presented the NIST findings which are attached. There was some discriminating ability exhibited by the Actiec 2 flux compared to the Actiec 5 and R fluxes when using wetting balance parameters as response variables. However all of the samples from all groups tested failed the dip and look test. There was no detectable difference in test results across the three fluxes or across the active wetting vs current standard visual inspection requirements. These samples did not provide any discriminating ability for the factors tested. These samples exhibited poor solderability test performance and would be considered not solderable for a circuit board assembly soldering operation. This was infact the case. Download the complete report (PDF). 2.3.3 Current Data Summary Supporting Change to Actiec 2 Flux 1) Analysis of wetting balance data comparing Actiec 2 with R flux from Fall '99 and Spring '00 showed less wetting balance parameter variation with the Actiec 2 flux compared to R flux. 2) George Wenger 4 lead tabs exhibited poor solderability and were rejected during solderability testing using both R and Actiec 2 flux . The proposed Actiec 2 flux did not allow the poor soldering shields to pass the dip and look test. 3) NIST metal shield data which exhibited a range of active wetting, all failed the dip and look test using either R or Actiec 2 or Actiec 5 fluxes. Again poor soldering shields did not pass the solderability test using the Actiec 2 flux. 4) IPC/STC/JEDEC Joint Test Plan underway. 2.3.4 IPC 5-23b/ EIA - STC/ JEDEC JC 13 TG9901 Joint Test Plan Mr. Kwoka briefly reviewed the Joint Test Plan which has been agreed to between the IPC 5-23b, EIA STC and the JEDEC JC 13 TG9901. The test plan is being run to validate and determine choices of Solder Dwell Time(3 sec vs 5 sec), Solder Test Flux (R vs Actiec 2) and Solder Test Temperature ( 235 vs 245 C). Experimental units used for this study are "marginal" 44ld MQFP, 8ld SOIC, 14ld CERDIP, 14ld PDIP, 2 ld Chip Caps. The testers participating in the study are Kon Lin, Dave Hillman, George Wenger. Carol Handwerker/Kil-Won Moon/Maureen Williams . George Wenger completed his sample evaluations and presented his results which are given below. Mr. Wengers' full report is attached. At 5 seconds of test time no difference among the tested units was observed using either 235 or 245 C solder temperature regardless of which flux was used. All of these "marginal samples" pass the dip and look test. At 3 seconds of test time we do see some rejects but a clear pattern has not emerged. We will wait for the remainder of the testers to complete their work before drawing any conclusions. Also the group felt that the referee board assembly should be completed for reference. ACTION ITEM: Kwoka to send board assembly samples from same lots to Hillman for board assembly. Hillman to report results at next meeting. Download the complete report (PDF). 2.3.5 BGA Solderability Test Mr. Kwoka reviewed an e-mail from D. Hillman to D. Bergman regarding BGA solderability testing. Although there is not "BGA" solderability test specified in J Std-002A, the Test S can be used to assess solderability on BGA packages. This item will be dropped from future agenda's. 2.3.6 Double Dip vs Single Dip for Gold Only George Wenger provided the reference for the Vianco Paper on this topic. It is : Vianco, Paul T., Sandia National Labs, "Embrittlement of Surface Mount Solder Joints by Hot-Dipped, Gold Plated Leads", Proceeding of the Technical Program Surface Mount International, San Jose, CA, Aug 29-Sept 2, 1993, pp 337-355 2.3.7 Post Steam Age Dry The group agreed to insert the post steam age drying time of 15 minutes minimum into Rev B. 2.3.8 Soldering Iron Test The group asserted that there was not any members present that were required to use this test and questioned the actual industry usage. In order to be added to the J Std-002, it was felt that the test should be "commonly" used or at least not be rare or minimal incidence. ACTION ITEM: Mr. Kwoka to check with JEDEC and obtain a list of current users of the soldering iron test for review at the next meeting. 2.4 Lead-free testing and requirements and STC role/responsibilities Mr. Kwoka provided a brief report on the ad hoc Lead-Free Components Focus Group. The STC will await industry results and the results from this Focus Group before considering changes to the J Std-002. 2.4 JEDEC Revision of Mil STD883/2003, Mil Std750/2026 and participation in ANSI J/STD-002-B revision Mr. Kwoka discussed the activities at the last JEDEC Meeting and the revision of the Joint Test Plan which has been discussed above. Mr. Kwoka also reiterated that the JEDEC people have been very cooperative and are working in good faith to review the J Std-002 and adopt as much as possible the J Std-002 into the Mil Std 883 TM 2003 and the Mil Std 750 TM 2026. Also the JC-14 , through Nick Lycoudes, is being very open minded in considering the J Std-002. It was suggested that perhaps our next meeting could be a joint meeting between the members of IPC 5-23b, EIA-STC, JEDEC JC 13 TG9901 and JC 14.1 . ACTION ITEM: Mr. Kwoka to contact the various committee chairmen to arrange this joint meeting 3 New business There was no new business. 4 Selection of next meetings The Committee considered meeting in conjunction with the 2nd ECA Engineering Summit scheduled for 4/2001. The group was unsure of the synergy the summit might provide and expressed preference to meeting adjacent to or during a wider conference complete with technical paper presentations. The group unanimously approved having the meeting in conjunction with IPC APEX on 14 - 18 January 2001 in San Diego. The meeting will be tentatively set for Monday, 15 January 2000 to allow ease of attendance for the JC-14.1 people who will be meeting the previous week in San Diego. ACTION ITEMūM.Tinkleman/C.Williams to make meeting arrangements with Ms Jane S. Koh (IPC) @ tel: 847.790.5349; fax: 847,509.9798; email: janekoh@ipc.org 5 Adjournment The Committee moved, seconded, and unanimously agreed to adjourn at 4:50 PM. 6 Action items
This meeting was conducted in accordance with the EIA legal guidelines and the EIA manual of organization and procedure. Mark Kwoka, Chairperson
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