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Joint Soldering Technology Committee
Tuesday, April 16, 2002
1:00 pm - 5:00 pm

1.0 Introductions and Roster Modifications

2.0 September Meeting Minutes Approval

3.0 Subcommittee Reports
3.1 Review/status of ANSI J STD-001C comments...................Russell/Committee
3.2 J STD-oo2B Ballot Status................................................Hillman/Russell
3.2.1 IPC 5-23b/EIA STC/JEDEC JC 13 TG9901 joint test plan completed
-Solder temperature 235C vs. 245C
-3 s vs. 5 s solder immersion time
-R vs. Actiec II flux
Component Test Sample Results
"Marginal" 44ld MQFP, 8ld SOIC, 14ld CERDIP, 14ld PDIP, 2 ld ChipCaps Board level assemply results

4.0 JEDEC participation/adoption in ANSI J STD-002B Revision.....Russell

5.0 Lead Free Testing and Evaluations...............................Russell
5.1 Current "lead free" activities - New Whisker Research

6.0 New Business.................................................................Committee

7.0 Next Meeting Location/Adjournment.........................Committee

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