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ECA
Soldering Technology Committee Meeting
AGENDA
Tuesday, 15 April 2003 1:30 - 5:00pm Tempe, Arizona
1) Introductions and Roster modifications
2) October meeting minutes approval
3) Subcommittee
Reports:
A)Review/status
of ANSI J STD-001C - Romm /Committee
- A New revision
activity was kicked off in New Orleans last November. A working
draft is being prepared for ballot/comments. The STC should expect
to receive a draft for review/comments during the next 3 months.
B)Review/status
of ANSI J STD-002C - Romm/Committee
- Pb-free criteria
Is it necessary to test with SnAgCu solder or can SnPb be used .
Is it necessary to use 255C solder pot temp or is current 245 OK.
- Consolidation
of Mil 883/2003 and Mil 750/2026 into 1 spec that references to
J-STD-002.
JEDEC JC-13 is balloting a proposal for this consolidation now that
the J Std-002B has been published. The JEDEC JC-13 will review the
ballot status at the upcoming JEDEC JC-13 meeting in May in Colorado
Springs.
4) JEDEC participation/adoption in ANSI J STD-002B Romm/Committee
J Std-002B is complete and approved by the JEDEC Board of Directors
and has been published.
5) Proposal to
evaluate replacements for steam age Romm/Committee
6) Brainstorm
- New and Timely topics for committee work Committee
7) Next meeting
Location/Adjournment Committee
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