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Joint Soldering Technology Committee

Next Meeting: April 14-17, Tempe, Arizona (Tentative)

Meeting Date Notice Agenda Roster Minutes Attachments
October 8, 2002 10/09 10/09
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April 16, 2002 04/16
04/16
04/16
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October 9, 2001 10/09 10/09
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January 15 , 2001 01/15
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September 14, 2000
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 09/14 09/14
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Committee Scope: The STC encompasses soldering practices (soldering iron-mass reflow techniques) and associated soldering materials (solders, pastes and adhesives, and flux/cleaning agents). However, the Committee will focus on solderability test method development for printed through-hole (PTH) and surface mountable components. One of the major functions is to promote commonality and standardization of soldering test methodology within the EIA Sectors.