Electronic Components, Assemblies & Materials Association

Committees

Soldering Technology

Next Meeting: Fall 2008

Meeting Date Notice Agenda Roster Minutes Attachments
March 31 - April, 3 2008   03/31-04/03 (PDF)   03/31-04/03 (PDF DOE Report (PowerPoint)
September 25, 2007   09/25 (PDF)   09/25 (PDF) Spec. Comparison (Excel)
April 17, 2007   04/17 (PDF)   04/17 (PDF)  
September 26, 2006       09/26 (PDF)  
April 27, 2006   04/27 (PDF)   04/27 (PDF)  
October 17-20, 2005   10/18 (PDF)   10/18 (PDF)  
May 17, 2005   05/17 (PDF)   05/17 (PDF)  
October 5, 2004   10/05 (PDF)   10/05 (PDF) Shell Life Study
Test Plan Revision
April 20, 2004   04/20 (PDF)   04/20 (PDF)  
October 7, 2003
10/07
April 15, 2003 04/15
October 9, 2002 10/09 10/09
April 16, 2002 04/16
October 9, 2001 10/09 10/09
January 15 , 2001 01/15
September 14, 2000
09/14 09/14

 

Committee Scope: The STC encompasses soldering practices (soldering iron-mass reflow techniques) and associated soldering materials (solders, pastes and adhesives, and flux/cleaning agents). However, the Committee will focus on solderability test method development for printed through-hole (PTH) and surface mountable components. One of the major functions is to promote commonality and standardization of soldering test methodology within the EIA Sectors.

Downloads: Active Projects (PDF)