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Minutes of P-9 Committee on Test Methods and Procedures
October 4, 2000
Wyndham Hotel San Diego, CA

Name
Organization
Members Present
Jose Cruz Compaq Computer Corp.
Daniel Giblin Cooper Busman
Caddy Greenidge Bradford Electronics
Paul Krystek IBM Corporation
Laird Macomber Cornell-Dubilier
Michael Mosier North American Capacitor
Domingo Pichardo Lucent Technologies
Christine Pollock Presidio Components
Bob Reinhard CTS Resistor
Chris Reynolds AVX Corporation
George Witt Lucent Technologies
Members Absent
James Canner Murata Electronics
Brian Piscitelli KOA Speer Electronics
Ron Rice Aerovox, Inc.
Dick Thompson Kemet Electronics
Others Present
Diane L. Bicknese Cooper Electronic Technologies
Robert Blodgett Taiyo Yuden (USA), Inc.
Cornelius Clark Cooper Electronic Technologies
Richard Drawz Boeing Commercial Airplane
Nick Ilie San-O Industrial Corp.
Mike Lauri Agilent Technologies
Bill O'Hirok Cannon - A div. of ITT Industries
Michael Radecki Defense Supply Center Columbus
Felix Santilli Mini-Systems, Inc.
Mark St.Clair Agilent Technologies
Michael Tinkleman EIA/ECA

1.0 Introductions

Self-introductions were made.

2.0 Committee Organization and Procedures
2.1 Membership and Attendance

Attendance was taken, and it was determined that a quorum was present. The chairman indicated that he had reactivated P-9 two years ago in order to address some testing issues. He requested that the P-9 membership list be updated in the EIA TIMMS database. Action Item

2.2 Approval of Agenda

Agenda was approved.

2.3 Approval of April 5, 2000 Meeting Minutes

Motion carried approving the April 2000 minutes.

2.4 Correspondence

Letter to Paul Krystek on generic test methods. Letter sent to DSCC to check on DSCC interest in combining their test methods with those of EIA. Need to set up a conference call with DSCC to discuss coordination especially with respect to Mil Specs 186, 196 and 202. Action Item

He cited DSCC and EIA cooperation on harmonizing EIA-364 and Mil Spec test procedures. DSCC is planning to cancel Mil Spec-1344 and use EIA-364 instead.

2.5 Review of the Committee's Scope

P-9 would like to be oversight/clearinghouse for the Testing area for all P-Committees. How do you get all testing to go through P-9? How do you ensure coordination with other committees such as STC when it publishes a new test procedure such as EIA-654, "Resistance to Soldering Heat Test Procedure for Wire and Electrical Components?"

A scope Task Force - Paul Krystek, Mike Mosier and others will look at changing the committee scope to accomplish these goals.


3.0 Reports
3.1 DSCC report

DSCC report for P-9 is attached.

3.2 STC (Soldering Technology Committee) Report

See minutes of 9/14/2000 STC Committee meeting on the Engineering Center portion of the ECA web site www.ec-central.org

3.2 Report on the U-1 Committee

See minutes of 10/3/2000 U-1 Committee meeting on the Engineering Center portion of the ECA web site www.ec-central.org

4.0 Old Business
4.1 Review of EIA-186-E, "Standard Test Methods for Passive Electronic Component Parts: General Instructions and Index of Tests"

Motion: - Passed unanimously to review EIA-186-E. A new PN # for EIA-186-F is needed. Action Item

4.2 Five-year Review of Documents

Committee requested a list of the active P-9 documents. Action Item

5.0 New Business

Motion: - EIA-327-A, "Solvent Resistance of Applied Marking Materials" should be rescinded with a reference made to Mil Spec 202. Motion approved.

6.0 Next Meeting

The next meeting will be at the 2nd Engineering Summit 4/23-25/2001 in San Antonio.

7.0 Adjournment

The Committee moved, seconded, and unanimously agreed to adjourn at 12:03 PM.

8.0 Action Items

Update P-9 membership list in the EIA TIMMS database.

Conference call with DSCC to discuss coordination with respect to Mil Specs 186, 196 and 202.

New PN # for EIA-186-F.

List of the active P-9 documents.

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

Mike Mosier, Chairman
Signature on file

Michael Tinkleman, Secretary
Signature on file

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