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P-9 Test Methods & Procedures Committee

Wednesday, 5 April 2000
Quality Hotel
Arlington, Virginia

1 Committee organization and procedures

1.1 Membership and attendance
Self-introductions were made, attendance taken, and it was determined that a quorum was present.

1.2 Approval of the Agenda
The Committee unanimously accepted the Agenda as presented.

1.3 Approval of the Minutes
The Committee unanimously accepted the Minutes of the last meeting as written.

1.4 Correspondence
No correspondence was received.

1.5 Review of the Committee's scope
No action was taken by the Scope Task Force (Messrs Mosier, Macomber, Canner, and Krystek).

ACTION ITEM - The Task Force will meet shortly to revise the scope.

1.6 Report of task groups and DSCC efforts
A DSCC was reported and will be attached to the Minutes.

2 Old business

2.1 Review of EIA-186-E, Standard test methods for passive electronic component parts: General Instructions and Index of Tests.
Mr. Mosier reported that he has not yet be able to put together all comments on reviewed test Methods. He will attempt to complete by next meeting.
The solderability standard is out-of date and should have a pointer to the J/STDs on soldering.

3 New business

4 Selection of next meetings
Week of 2 October 2000

5 Adjournment
The Committee moved, seconded, and unanimously agreed to adjourn at 9:03 AM.

6 Action items
Add ACH Minutes to the U-1 meeting.
Add STC Minutes to the P-9 meeting Minutes.

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

DSCC P-9 Report, April 2000

The following test methods of MIL-STD-202 are currently under review and draft revisions are being prepared:
-method 101 - Salt spray (corrosion)
-method 106 - Moisture resistance
-method 107 - Thermal shock
-method 109 - Explosion
A schedule for distribution of these draft revisions has not yet been determined.

It is also anticipated that the following test methods of MIL-STD-202 will be reviewed in the next few months for possible revision:
-method 304 - Resistance-temperature characteristic
-method 305 - Capacitance
-method 306 - Quality factor (Q)
-method 309 - Voltage coefficient of resistance determination procedure

The P-9 committee or individual committee members may send comments on any of these test methods at any time to:
Mr. Patrick Kyne
DSCC-VAT
PO Box 3990
Columbus, OH 43216-5000
or by e-mail to patrick_kyne@dscc.dla.mil

When completed, the initial drafts of these revisions will be distributed for review and comment.

EIA SOLDERING TECHNOLOGY COMMITTEE
Activities for Oct 99 - Mar 00

The EIA Soldering Technology Committee held one meeting during this time. The following activities were done:

A) Continued review of work items for next revision, ANSI J STD-002 revision B draft. Began collaborative effort with JEDEC JC-13 via JEDEC task group TG 9901. This group will participate in the revision of ANSI J STD-002B and will also be revising the Mil Std 883/2003 and Mil Std 750/2026 with the goal of adopting "as much as possible" the new ANSI J STD-002B per the Perry Initiative.

B) Reviewed new draft of ANSI/J-STD-001C.

C) Issued ballot responses and submitted Resistance to Soldering Heat (PN-2272C) specification to EDEC for approval.

D) Completed 2nd evaluation of the "Active Wetting" proposal for solderability test assessment. Results were inconclusive and a third and final study is underway.

E) Continued investigation of R vs Actiec 2 RMA flux for solderability testing in ANSI J STD-002B.

F) Continued discussion of solderability testing requirements for Nickel Palladium.

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