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Minutes of P-3 Committee on Inductive Devices
October 10, 2001
Loews Philadelphia Hotel, Philadelphia, PA

Members Present
Brian Piscitelli KOA Speer Electronics
Robert Blodgett Taiyo Yuden (USA) Inc.
Cornelius Clark Cooper Electronic Technologies
William Gisseler TDK Corporation of America
Ted Coler Vishay
Phil Diglio EPCOS Inc. USA
Manfred Espenhain EPCOS AG
Barry Friedman Lucent Technologies
Len Metzger Panasonic Industrial Company
David Ritchey Phycomp
Volker Scharrer EPCOS AG
Yan Ma AEM
Ed Mikoski EIA/ECA
Member Organizations Present
Present at Previous Meeting?
AEM Yes
Cooper Electronic Technologies No
KOA Speer Electronics Yes
Lucent Technologies No
Panasonic Industrial Company Yes
Taiyo Yuden (USA) Inc. Yes
Vishay Yes
Yageo (Phycomp USA, Inc.) Yes
TDK Corporation of America Yes
EPCOS Inc. Yes
Member Organizations Absent
Present at Previous Meeting?
Agilent Technologies No
AVX Corporation Yes
IBM Corporation Yes
Steward Yes
FCI No
Coilcraft No
BI Technologies No
Others Organizations Present
EIA/ECA  

1.0 Committee Organization and Procedures

1.1 Membership Attendance
Self-introductions were made. Attendance was taken, and it was determined that a quorum was present.

1.2 Approval of Previous Meeting Minutes
The minutes of the Tuesday, 24 April 2001 meeting held at the Hyatt Regency in San Antonio, TX were unanimously approved.

1.3 Approval of Agenda
The Committee unanimously accepted the Agenda as presented.

1.4 Correspondence
The Chair stated that he had received several e-mails regarding documents PN-4233 and PN-4315. He highlighted the comments and how he addressed them. The goal is to ballot the documents again before the April 2002 meeting. The Draft specifications had been sent out within the last year via e-mail as attachments along with the ballot.

2.0 Old Business

2.1 Review results of balloted PN-4233, "Surface Mount Inductor Qualification Specification"
PN-4233 Surface mount Inductor Specification critical issues were covered on a Microsoft PowerPoint presentation by the Chair. The vote response was inadequate and the spec has been in the process for a long time. An effort will be made to make sure that members return ballots the next round. The committee members agreed to be more responsive to ballots.
Some of the items commented on were:
Paragraph
4.4 Life Test (e) - Change inductance values from 10% to 15%
4.5.1 Load humidity test (f) change values from 30% to 15%
7.4.6 Thermal Shock ( c ) change 30% to 20%
8.4.8 Shock ( c ) change 25% to 10%
8.4.12 Solderability (a) and Soldering Heat (b) should reference IPC/EIA J-STD-002 instead of MIL-STD-202 method 208
8.4.13 Change 30% to 20%

The committee agreed to these changes that will be modified in the draft document.
Discussion then pursued regarding Para 4.4. It was felt that the range variance varied by technology so it would be better to develop a table. A DL% table would be included in the standard by Categories (A,B,C,D,…) This would be by ranges of DL% instead of a listing by technology and referred to as a 'Maximum Inductance Change' table.

The committee wishes to get this draft document circulated prior to Thanksgiving for review and comment. Then an official ballot will be sent out to the committee mid January so it will be ready for the April Summit.

2.2 PN-4315, "Surface Mount Ferrite Chip Bead Qualification Specification" Discussions
The committee addressed comments that were received on the document. It then agreed to add an Impedance Change Table similar to the one agreed upon that will be added to PN-4233. This document will proceed on a similar schedule as discussed above for PN-4233, except the official ballot distribution will be targeted for mid February 2002.

3.0 New Business and Opportunities

3.1 Review merged Multilayer-Wire wound Specification draft
This issue has been addressed in the PN-4233 document.

3.2 Surface Mount multiplayer (ceramic) inductors
This issue has been addressed in the PN-4233 document.

3.3 Other New Business
Mr. Friedman posed several issues for the committee to address:
-He asked how the committee could come up with a standard set of impedance values for beads similar to what exists for inductors. This will be a new agenda item for the next meeting.
-Another suggestion would be to publish impedance versus frequency with bias.
-There are different types of beads with numerous names so it gets very confusing. How about some standard terminology?

These issues will be discussed in more detail at the next meeting.

4.0 Next Meeting
The next meeting will be at the 4th ECA Engineering Summit Week of 14 April, 2002 in Albuquerque, NM at the Sheraton Old Town Hotel.

5.0 Adjournment

The meeting was adjourned at approximately 10:00 AM

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

Bill Gisseler, Chairperson
Signature on file

Edward F. Mikoski, Jr., Acting Secretary
Signature on file

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