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Minutes of P-3 Committee on Inductive Devices
October 9, 2002
Marriott City Center, Charlotte, NC

Members Present
James Canner Murata Electronics    
William Gisseler TDK Corporation of America    
Terry Charles Panasonic    
Patrick Kyne DSCC    
David Ritchey Yageo/Phycomp    
Dave Richardson Vishay    
Mike Lauri IBM    
Ming Li AEM    
Ed Mikoski EIA/ECA    
Chris Reynolds AVX    
Len Metzger Panasonic    
Member Organizations Present
Present at this meeting?
Present at previous meeting?
Present at meeting prior to previous?
AEM
Yes
Yes
Yes
AVX Corporation
Yes
Yes
No
IBM Corporation
Yes
Yes
No
Murata
Yes
No
No
Panasonic Industrial Company
Yes
Yes
Yes
Steward
Yes
No
No
TDK Corporation of America
Yes
Yes
Yes
Vishay
Yes
No
Yes
Yageo (Phycomp USA, Inc.)
Yes
Yes
Yes
Member Organizations Absent
Present at this meeting?
Present at previous meeting?
Present at meeting prior to previous?
Cooper Busmann/Electronic Technologies
No
Yes
Yes
EPCOS, Inc.
No
Yes
Yes
Intel Corp.
No
Yes
No
KOA Speer Electronics
No
Yes
Yes
Lucent Technologies
No
No
Yes
Taiyo Yuden
No
Yes
Yes
Others Organizations Present
DSCC      
EIA/ECA      

1.0 Committee Organization and Procedures
1.1 Membership Attendance
Self-introductions were made. Attendance was taken, and it was determined that a quorum was present.

1.2 Approval of Previous Meeting Minutes
The minutes of the 17 April 2002 meeting held at Sheraton Old Town Inn, Albuquerque, NM, were unanimously approved.

1.3 Approval of Agenda
The Committee unanimously accepted the Agenda as presented.

1.4 Correspondence
Correspondence was received from IBM by the Chairman regarding document PN 4233.

2.0 Old Business

2.1 Nominations for Secretary of P-3 Committee.
Due to increased business commitments M. Griffith, KOA was unable to continue in this role. The chair asked for any volunteers from the attendees. None responded. Ed Mikoski, EIA/ECA staff acted as Secretary.

2.2 Complete review of PN-4233 Surface Mount Inductor Qualification Specification
Specification was vote accepted by quorum, requires finalization for applicable test documents. The group reviewed and discussed Table 2 dealing with variation of inductance (L). They agreed that the verbiage on the Chart was acceptable as it stands. Also since the last meeting, several reference documents were changed and the Test Temperature in 4.4 was discussed. The range tolerance was adjusted from ±2°C to ±3°C. The group unanimously accepted the changes and the Chair agreed to send a response to IBM on the issue.

2.3 Complete review of PN-4315 Surface Mount Chip Bead Qualification Specification
Specification was vote accepted by quorum, requires finalization for applicable test documents. The document was altered to reflect the same reference changes as PN-4233. For consistency, the temperature tolerances in Table 4.4 were changed to reflect the adjustment made in PN-4233. (from ±2°C to ±3°C)

2.4 Submit completed PN-4233 Surface Mount Inductor Qualification Specification to ECA for publication
The committee unanimously voted to forward PN-4233 for publication as EIA standards subsequent to the Chair contacting the commenter from IBM with regard to the decision of the committee

2.5 Submit completed PN-4315 Surface Mount Chip Bead Qualification Specification to ECA for publication

The committee unanimously voted to forward PN-4315 for publication as EIA standards.

3.0 New Business and Opportunities

3.1 Review other Active P3 Projects and discuss
The committee reviewed the outstanding projects list and voted unanimously to rescind the following projects:

SP-3334 Multilayer Chip Inductor Qualification
SP-3337 Surface Mount Wound Inductor Qualification and
PN-2006 Standard for Chip Inductors

The committee unanimously voted to withdraw the following documents from publication:
EIA 217A Wound Cut Cores
EIA 393 Core Laminations, Vertical and Horizontal
EIA 197-A Power Filter Inductors for Electric Equipment
EIA IS48 Axial Lead Fixed Radio Frequency

3.2 Additional test and characterization of chip bead impedances
There was a general consensus that it is worthwhile to identify and clarify standard chip bead impedances, so this will be addressed at the next meeting.

3.3 Test procedures & recommended electrical parameters for SMD inductors & ferrite beads
This proposal came from EPCOS and will be discussed at the next meeting , since they were not present to address the issue at this meeting.

3.4 Surface mount multilayer (ceramic) inductors
Ceramic inductors will be discussed at the next meeting.

3.5 Other new business or activities
Patrick Kyne distributed DSCC brief on these components. This will be an attachment to the minutes.

4.0 Next Meeting
The next meeting will be at the ECA Spring Engineering Summit Week of 14-17 April, 2003 at the Tempe Mission Palms Hotel, Tempe, AZ (near Phoenix).

5.0 Adjournment
The meeting was adjourned at approximately 12:05pm.

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

Bill Gisseler, Chairperson
Signature on file

Edward F. Mikoski, Jr., Acting Secretary
Signature on file

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