|
Home
> Technology Center >
Engineering
Committees > P-3 Committee
Minutes
of P-3 Committee on Inductive Devices
October 9, 2002
Marriott City Center, Charlotte, NC
|
Members
Present
|
| James
Canner |
Murata
Electronics |
|
|
| William
Gisseler |
TDK
Corporation of America |
|
|
| Terry
Charles |
Panasonic |
|
|
| Patrick
Kyne |
DSCC |
|
|
| David
Ritchey |
Yageo/Phycomp |
|
|
| Dave
Richardson |
Vishay |
|
|
| Mike
Lauri |
IBM |
|
|
| Ming
Li |
AEM |
|
|
| Ed
Mikoski |
EIA/ECA |
|
|
| Chris
Reynolds |
AVX |
|
|
| Len
Metzger |
Panasonic |
|
|
|
Member
Organizations Present
|
Present
at this meeting?
|
Present
at previous meeting?
|
Present at meeting prior to previous?
|
| AEM |
Yes
|
Yes
|
Yes
|
| AVX
Corporation |
Yes
|
Yes
|
No
|
| IBM
Corporation |
Yes
|
Yes
|
No
|
| Murata |
Yes
|
No
|
No
|
| Panasonic
Industrial Company |
Yes
|
Yes
|
Yes
|
| Steward |
Yes
|
No
|
No
|
| TDK
Corporation of America |
Yes
|
Yes
|
Yes
|
| Vishay |
Yes
|
No
|
Yes
|
| Yageo
(Phycomp USA, Inc.) |
Yes
|
Yes
|
Yes
|
|
Member
Organizations Absent
|
Present
at this meeting?
|
Present
at previous meeting?
|
Present at meeting prior to previous?
|
| Cooper
Busmann/Electronic Technologies |
No
|
Yes
|
Yes
|
| EPCOS,
Inc. |
No
|
Yes
|
Yes
|
| Intel
Corp. |
No
|
Yes
|
No
|
| KOA
Speer Electronics |
No
|
Yes
|
Yes
|
| Lucent
Technologies |
No
|
No
|
Yes
|
| Taiyo
Yuden |
No
|
Yes
|
Yes
|
|
Others
Organizations Present
|
| DSCC |
|
|
|
| EIA/ECA |
|
|
|
1.0
Committee Organization and Procedures
1.1 Membership Attendance
Self-introductions were made. Attendance was taken, and it was determined
that a quorum was present.
1.2 Approval of Previous Meeting Minutes
The minutes of the 17 April 2002 meeting held at Sheraton Old Town
Inn, Albuquerque, NM, were unanimously approved.
1.3 Approval
of Agenda
The Committee unanimously accepted the Agenda as presented.
1.4 Correspondence
Correspondence was received from IBM by the Chairman regarding document
PN 4233.
2.0 Old Business
2.1 Nominations for Secretary of P-3 Committee.
Due to increased business commitments M. Griffith, KOA was unable to
continue in this role. The chair asked for any volunteers from the attendees.
None responded. Ed Mikoski, EIA/ECA staff acted as Secretary.
2.2 Complete
review of PN-4233 Surface Mount Inductor Qualification Specification
Specification was vote accepted by quorum, requires finalization for
applicable test documents. The group reviewed and discussed Table 2
dealing with variation of inductance (L). They agreed that the verbiage
on the Chart was acceptable as it stands. Also since the last meeting,
several reference documents were changed and the Test Temperature in
4.4 was discussed. The range tolerance was adjusted from ±2°C
to ±3°C. The group unanimously accepted the changes and the
Chair agreed to send a response to IBM on the issue.
2.3 Complete
review of PN-4315 Surface Mount Chip Bead Qualification Specification
Specification was vote accepted by quorum, requires finalization for
applicable test documents. The document was altered to reflect the same
reference changes as PN-4233. For consistency, the temperature tolerances
in Table 4.4 were changed to reflect the adjustment made in PN-4233.
(from ±2°C to ±3°C)
2.4 Submit completed
PN-4233 Surface Mount Inductor Qualification Specification to ECA for
publication
The committee unanimously voted to forward PN-4233 for publication as
EIA standards subsequent to the Chair contacting the commenter from
IBM with regard to the decision of the committee
2.5 Submit completed PN-4315 Surface Mount Chip Bead Qualification Specification
to ECA for publication
The committee unanimously voted to forward PN-4315 for publication as
EIA standards.
3.0 New Business
and Opportunities
3.1 Review other Active P3 Projects and discuss
The committee reviewed the outstanding projects list and voted unanimously
to rescind the following projects:
SP-3334 Multilayer
Chip Inductor Qualification
SP-3337 Surface Mount Wound Inductor Qualification and
PN-2006 Standard for Chip Inductors
The committee unanimously
voted to withdraw the following documents from publication:
EIA 217A Wound Cut Cores
EIA 393 Core Laminations, Vertical and Horizontal
EIA 197-A Power Filter Inductors for Electric Equipment
EIA IS48 Axial Lead Fixed Radio Frequency
3.2 Additional
test and characterization of chip bead impedances
There was a general consensus that it is worthwhile to identify and
clarify standard chip bead impedances, so this will be addressed at
the next meeting.
3.3 Test procedures
& recommended electrical parameters for SMD inductors & ferrite
beads
This proposal came from EPCOS and will be discussed at the next meeting
, since they were not present to address the issue at this meeting.
3.4 Surface mount
multilayer (ceramic) inductors
Ceramic inductors will be discussed at the next meeting.
3.5 Other new
business or activities
Patrick Kyne distributed DSCC brief on these components. This will be
an attachment to the minutes.
4.0 Next Meeting
The next meeting will be at the ECA Spring Engineering Summit Week of
14-17 April, 2003 at the Tempe Mission Palms Hotel, Tempe, AZ (near
Phoenix).
5.0 Adjournment
The meeting was adjourned at approximately 12:05pm.
This meeting was
conducted in accordance with the EIA legal guidelines and the manual
of organization and procedures.
Bill Gisseler, Chairperson
Signature on file
Edward F. Mikoski,
Jr., Acting Secretary
Signature on file
Return
to P-3 Menu
|