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Minutes of P-3 Committee on Inductive Devices
April 24, 2001
Hyatt Regency San Antonio, Texas

Name
Organization
Members Present
Robert Blodgett Taiyo Yuden (USA) Inc.
Michael Foerster EPCOS, Inc.
William Gisseler TDK Corporation of America
Caddy Greenidge Vishay-Bradford
Michael Griffith KOA Speer Electronics
Nick Marshall (for Paul Krystek) IBM Corporation
Rick Meadors (for David Vernetti) Steward
Leonard Metzger Panasonic Industrial Company
David Ritchey Phycomp
Chris Reynolds (for Dennis Lieneman) AVX Corporation
Members Absent
Yakov Belopolsky FCI/Berg Electronics
James Boytor Coilcraft, Inc.
Cornelius Clark Cooper Electronic Technologies
Barry Friedman Lucent Technologies
Mark St. Clair Agilent Technologies
Ron Sullivan BI Technologies
Others Present
Ken Bernier DSCC
Terry D. Charles Panasonic
Manfred Espenhain EPCOS
Jesus V. Garcia III DSCC
Ming X. Li AEM, Inc.
Rick Plunkett BC Components
Volker Scharrer EPCOS
Michael Tinkleman EIA/ECA

DRAFT

1.0 Committee Organization and Procedures
1.1 Membership and Attendance

Self-introductions were made. Attendance was taken, and it was determined that a quorum was present. The attendance roster and the CTA roster are in process of being updated to reflect the most current members present. All attendees verified the correctness of the information on the rosters.

The Committee was reminded of the Committee membership rule, which states that if a member misses two consecutive meetings, then at the third missed meeting, the member is moved from the membership list to the non-voting CTA list. The member will be re-instated at the next meeting attended. This rule comes from EIA EP-20-A, "Manual of Organization & Procedure," December 2000, Section 4.6.1.1 Meeting Quorum Pool (page 17-18), which states that: -

A meeting quorum pool is defined as those members eligible to vote at a meeting:

a) If a voting member is not represented at two consecutive meetings and the absence continues for the subsequent meetings, the member shall be removed from the Meeting Quorum Poll for the subsequent meetings. Upon attendance at a subsequent meeting the member shall be reinstated in the Meeting Quorum Poll and have full voting privileges at that meeting.

1.2 Approval of October, 2000 Meeting Minutes

The Committee unanimously accepted the Minutes of the last meeting as written. A list of active P-3 Committee projects will be attached to the minutes. Action Item

1.3 Approval of Agenda

The Committee unanimously accepted the Agenda as presented.

1.4 Correspondence

No correspondence.

2.0 Old Business
2.1 Review of Membership list to ensure all committee members receive correspondence

Covered in 1.1 above.

2.2 Review results of balloted PN-4233, "Surface Mount Inductor Qualification Specification"

Currently out on 30-day EIA letter ballot until 5/4/2001. Committee members were requested to respond to ensure a ballot quorum.

2.3 PN-4315, "Surface Mount Ferrite Chip Bead Qualification Specification" Discussions

The committee discussed the percentage tolerance for impedance change in PN-4315, and agreed to change the value from +/-10% to +/-15%. The sentence would now read "The impedance value shall not change by more than +/- 15% from the initial value." This change will be made in paragraphs 4.4e), 4.5.1f), 4.6d), 4.8b) and 4.12a). Also, in 4.2a) change temperature to 20 C.

Motion: - To amend the draft of PN-4315 to +/- 15% for impedance change in cited sections, and to change temperature rise in 4.2a) to 20 C.
Results of Motion: - For - 8, Opposed - 1 (Panasonic), Abstentions - 1 (Phycomp). Motion carried.

2.4 PN-4315, "Surface Mount Ferrite Chip Bead Qualification Specification" Discussions - Committee Vote

Motion: - Motion was made to ballot PN-4315, as revised at today's meeting, on a 30-day EIA letter ballot to be published as an EIA standard.
Results of Motion: - Motion carried unanimously. Action Item

2.5 Parts Dimension and Land Patterns Document

No action on P-4 inductor outlines due to pending P-4 meeting discussions.

3.0 New Business and Opportunities

Review merged Multilayer-Wire wound Specification draft.

Merger of EIA/IS-759, "Multilayer Chip Inductor Qualification Specification" with EIA/IS-760, "Surface Mount Wire wound Inductor Qualification Specification." Earlier draft of merged specification still needs to be located. Michael Tinkleman to contact Barry Friedman, Lucent to see if he has a copy. Action Item

3.1 P-3 Secretary for Meeting Minutes

Michael Griffith will be Secretary.

3.2 New Discussion Areas

Add surface mount multilayer (ceramics) inductors to fall meeting agenda.


3.3 Agilent E4991AR RF Analyzer

An overview of the capabilities of the Agilent E4991AR RF Analyzer were covered.

4.0 Next Meeting

The next meeting will be at the 3rd Engineering Summit 10/8-10/2001 in Philadelphia at the Loews Hotel.

5.0 Adjournment

The Committee moved, seconded, and unanimously agreed to adjourn at 5:15 PM.

6.0 Action Items

P-3 active project list - to be attached to minutes.

PN-4315 - Make approved changes and send out on a 30 day EIA letter ballot.

Merged Multilayer-Wire wound Specification draft - try to locate a copy.

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

Bill Gisseler, Chairperson
Signature on file

Michael Tinkleman, Secretary
Signature on file

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