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P-2.5 Tantalum Capacitors Committee

Wednesday, October 10, 2001
10:00 am - 12 Noon
Loews Philadelphia Hotel
Philadelphia, PA

1. COMMITTEE ORGANIZATION AND PROCEDURES
1.1 Membership and attendance
1.2 Review and approve agenda
1.3 Approve minutes of last meeting, San Antonio, April 25, 2001
1.4 Correspondence

2. OLD BUSINESS
2.1 Reports
2.1.1 Passive Component User's Group (U.1)…………..Keith Seamands, Chairman
(Announcement of future meeting dates and locations)
2.1.2 Government Specifications and Standards……… DSCC Representative
2.2 Surface Mount Tantalum Capacitors
2.2.1 Status: Standard (EIA-535BAAC), Low ESR (EIA-535BAAE). Update 2012 case.
2.2.2 Discussion of new case sizes, ratings, or products….All Members
2.2.2.1 Non-molded miniature sizes 2012 and 1608.
2.2.3 Global standardization of tantalum specifications…..All Members
2.3 High temperature (150C and up) applications for molded chip tantalums
2.4 Hazardous material (lead free, etc) considerations for tantalum chips
2.4.1 Report on NEMI lead free solder activity
2.5 Review updates to Tantalum - Polymer draft specification
2.6 Discussion of moisture sensitivity tests for SMD solid and polymer tantalums
2.7 Review the EIA catalogue specification list
2.8 Review and update EIA list of "active working projects"
2.9 Update on Niobium capacitors

3. NEW BUSINESS
3.1 Any new business….All Members

4. ADJOURNMENT

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