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P-2.5 Tantalum
Capacitors Committee
Wednesday, April
25, 2000
8:00 am - 10:00 am
Hyatt Regency
San Antonio, Texas
1. COMMITTEE
ORGANIZATION AND PROCEDURES
1.1 Membership
and attendance
1.2 Review and approve agenda
1.3 Approve minutes of last meeting, San Diego, October 3, 2000
1.4 Correspondence
2. OLD BUSINESS
2.1 Reports
2.1.1 Passive Component User's Group (U.1)
..Keith
Seamands, Chairman
(Announcement of future meeting dates and locations)
2.1.2 Government Specifications and Standards
DSCC
Representative
2.2 Surface
Mount Tantalum Capacitors
2.2.1 Status: Standard (EIA-535BAAC), Low ESR (EIA-535BAAE), and Fused
Specifications. Update 2012 case dimensions.
2.2.2 Discussion of new case sizes, ratings, or products
.All Members
2.2.3 Global standardization of tantalum specifications
..All Members
2.3 High temperature (150C and up) applications for molded chip tantalums
2.4 Hazardous material (lead free, etc) considerations for tantalum
chips
2.4.1 Report on NEMI lead free solder activity
2.5 Review updates to Tantalum - Polymer draft specification
2.6 Discussion of moisture sensitivity tests for SMD solid and polymer
tantalums
2.7 Review the EIA catalogue specification list
2.8 Review and update EIA list of "active working projects"
3. NEW BUSINESS
3.1 Update on Niobium capacitors
3.2 Other New business
.All Members
3.3 Election of new P2.5 Committee Officers
4. ADJOURNMENT
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