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P-2.5 Tantalum Capacitors Committee

Wednesday, April 25, 2000
8:00 am - 10:00 am
Hyatt Regency
San Antonio, Texas

1. COMMITTEE ORGANIZATION AND PROCEDURES
1.1 Membership and attendance
1.2 Review and approve agenda
1.3 Approve minutes of last meeting, San Diego, October 3, 2000
1.4 Correspondence

2. OLD BUSINESS
2.1 Reports
2.1.1 Passive Component User's Group (U.1)…………..Keith Seamands, Chairman
(Announcement of future meeting dates and locations)
2.1.2 Government Specifications and Standards……… DSCC Representative
2.2 Surface Mount Tantalum Capacitors
2.2.1 Status: Standard (EIA-535BAAC), Low ESR (EIA-535BAAE), and Fused Specifications. Update 2012 case dimensions.
2.2.2 Discussion of new case sizes, ratings, or products….All Members
2.2.3 Global standardization of tantalum specifications…..All Members
2.3 High temperature (150C and up) applications for molded chip tantalums
2.4 Hazardous material (lead free, etc) considerations for tantalum chips
2.4.1 Report on NEMI lead free solder activity
2.5 Review updates to Tantalum - Polymer draft specification
2.6 Discussion of moisture sensitivity tests for SMD solid and polymer tantalums
2.7 Review the EIA catalogue specification list
2.8 Review and update EIA list of "active working projects"

3. NEW BUSINESS
3.1 Update on Niobium capacitors
3.2 Other New business….All Members
3.3 Election of new P2.5 Committee Officers

4. ADJOURNMENT

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