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Home > Technology Center > Engineering Committees > P-2.5 Committee Minutes
of the P-2.5 Committee on Tantalum Capacitors
1.0
Committee Organization and Procedures Attendance was taken,
self introductions were made, and it was determined that a quorum was
present. The attendance roster and the CTA roster are in process of
being updated to reflect the most current members present. All attendees
verified the correctness of the information on the rosters. A meeting quorum pool is defined as those members eligible to vote at a meeting: a) If a voting member is not represented at two consecutive meetings and the absence continues for the subsequent meetings, the member shall be removed from the Meeting Quorum Poll for the subsequent meetings. Upon attendance at a subsequent meeting the member shall be reinstated in the Meeting Quorum Poll and have full voting privileges at that meeting. 1.2 Approval
of Agenda 1.3 Approval of October, 2000 Meeting Minutes The Committee unanimously accepted the Minutes of the last meeting as written. A list of active P-2.4 Committee projects will be attached to the minutes. Action Item 1.4 Correspondence Correspondence regarding
MIL-PRF-55365. Proposed addition of temperature reflow screening. This
was addressed at P-2.5 Task Force meeting. No changes recommended to
specifications. It's more of a company specific issue. 2.1 Reports 2.1.2 U-1 Committee Report U.1 report from Dave Richardson - Next Meeting is the Oct 8-10, 2001 Engineering Summit in Philadelphia, PA. Richard Parker from Delphi gave a telecom presentation on NEMI lead-free activities. Chris Reynolds gave a lead-free presentation. U-1 committee discussed the need for lead-free awareness and focus in all component committees. 2.1.2 DSCC Report of Government Specifications and Standards Ken Bernier, DSCC distributed the latest DSCC report. Discussions covered space grade MIL-PRF-55365 devices, and problems reported with moisture testing of Mil Tantalum chips. The DSCC report is attached. 2.2 Surface Mount
Tantalum Capacitors PN 4837 (3/28/2000) has been issued for work on EIA-535BAAC, "Specification for Fixed Tantalum Chip Capacitors, Style 1 Protected (Molded)". This specification needs to be updated for new ratings. In the P-2.5 Working Group meeting in October, it was agreed that committee would go forward with current version of specifications with the addition of a slash sheet for numbers that will change frequently. A Task Group to update the Slash Sheets was formed. Its members include Mike Griffith, Nancy Reynolds and Dave Toomey. PN 4838 (3/28/2000) has been issued for work on EIA-535BAAE, "Detailed Specification for Low ESR Molded Tantalum Chip Capacitors." Little interest in continuing with Fuse Specification. PN-3565 formally withdrawn during section 2.8 active project update. 2.2.2 Discussion of new Case Sizes, Ratings, or Products Working group discussed whether ratings tables should be included in the EIA Tantalum chip standards, given that they become obsolete quickly as manufacturers offer new ratings. Working group decided to keep the ratings tables and update them periodically. They also agreed to add a note to the various specifications that advises users to refer to individual manufacturer's literature for most current ratings availability. The possibility of putting updates on the ECA website was also discussed. Need to update ratings in 535BAAC and include changes to termination dimensions for 2012 case size that have already been approved. Need to make sure terminations are consistent in the new version. Discussed non-molded miniature (2012 and 1608 sizes). Now offered by three suppliers: AVX TAC series, Panasonic KE series and Vishay conformals. Committee agreed that a new specification is warranted. A subcommittee was formed to draft new specification. Members are Dave Toomey, Terry Charles, and Chris Reynolds. Action Item 2.2.3 Global Standardization of Tantalum Specifications Committee would like to harmonize standards with Europe and Japan but has struggled with how to best do this. It was suggested that we use the new polymer specification as a test for harmonization, and leave older specifications alone for now. There are both format and content differences between IEC and EIA specs. The IEC Sectional specification for tantalum capacitors includes qualification testing, but the EIA specification for standard Tantalum chips does not. (We have a totally separate specification for qualification testing - EIA 717). Epcos indicated that differences in format may be acceptable as long as the content is the same. Ed Mikoski suggested that we might try to get the US TAG (TC-40C) to meet at the same time as P-2.5. Dave Richardson will provide a copy of an existing spreadsheet comparing ACH's 481 specification with IEC's 60286-3 specifications for further background on the differences between EIA and IEC specifications. Action Item 2.3 High-temperature (³150 °C) applications for molded chip tantalums Both AVX and Epcos offer 150°C rated Tantalum chips. Visteon (Keith Seamands) has in the past stated that there is a need in the automotive industry for high temperature Tantalum chips. Group agreed that a specification is warranted now that there are multiple suppliers. Dave Toomey to request a new PN number for activity to draft a high temperature specification. Action Item Subcommittee to include Chris Reynolds and Michael Foerster. Keith Seamands will also be asked to participate. (He was unable to attend the P-2.5 meeting.) 2.4 Hazardous Material (Pb-free, etc…) considerations for Tantalum Chips Committee is continuing to track the lead-free issue and the groups involved and the lead-free combinations suggested to see what impacts they would have on tantalum capacitors. The U-1 committee had a lead free roundtable discussion. Several of the lead free presentations (NEMI, AVX) are available on the ECA web site. Michael Tinkleman to discuss with Ron Gedney the possibility of NEMI participation or a presentation at a future Engineering Summit. Action Item Group agreed to
keep the component detail and the qualification requirements in separate
documents as we do for standard tantalums. The polymer tantalum qualification
specification should follow same format as EIA-717, but will be a separate
specification. Until a qualification specification exists, the component
specification should move forward without reference to qualification
requirements. Subcommittee volunteers include Dave Richardson, Mike
Lauri, Michael Griffith, Terry Charles, and Nancy Reynolds. Need to add all commercially available ratings to the polymer draft specification. Mike Lauri will send to Nancy Reynolds all the vendor data sheets for inclusion of ratings in the draft specification. Nancy Reynolds will update draft and send to Michael Tinkleman to forward to the rest of P2.5. Action Item 2.6 Discussion of Moisture Sensitivity Level (MSL) Tests for SMD Solid and Polymer Tantalums Need to address Moisture Sensitivity Level (MSL) ratings for plastic-cased passive devices. MSL has been a requirement in the IC industry for many years. (Ref IPC/JEDEC J-STD-020). More OEMs are asking for this information on passives. Need to establish failure criteria for passives. Relevant to all molded tantalums (P-2.5) molded polymer aluminums (P-2.4), molded inductors (P-3), Testing (P-9), and Integrated Passives (P-10). First need to address MSL ratings for current Sn-Pb assembly processes, and then evaluate impact of Pb-free reflow processes. Dave Toomey will send a note to chairmen of P-2.4, P-3, P-9, and P-10 committees to see what existing MSL information they have, and to see what their interest in developing further MSL information is. Action Item 2.7 Review of EIA Catalog Specification List The P-2.5 specifications in the EIA Standards Catalog were reviewed, and a series of motions were made to withdraw the following specifications from the EIA Standards Catalog: - EIA 535AAAA, AAAB,
AAAC, AAAD, & AAAE - EIA specs for leaded tantalums, dated 1987.
- Motion carried unanimously. 2.8 Review and update EIA list of Active Projects Motion to withdraw
PN 4129, "Fused Molded Tantalum Chip" - Motion carried unanimously. 3.0 NEW BUSINESS 3.1 Update on Niobium Capacitors Nancy Reynolds and Michael Foerster volunteered for subcommittee on Niobium Capacitors. 3.2 Other New Business No other new business. 3.3 New Officers Motion to nominate Nancy Reynolds as new chairman. Motion passed unanimously. Nancy Reynolds is the new P-2.5 chairperson. Motion to nominate Dave Toomey as secretary/vice-chairman. Motion passed unanimously. Dave Toomey is the new secretary/vice-chairman. 4.0 Next Meeting The next meeting will be at the 3rd Engineering Summit 10/8-10/2001 in Philadelphia at the Loews Hotel. 5.0 Adjournment The Committee moved, seconded, and unanimously agreed to adjourn at 4:03 PM. 6.0 Action Items Attachment to the minutes a list of active P-2.5 specifications and working projects. Subcommittee was formed to draft new specification for non-molded miniature sizes (2012 & 1608). Dave Richardson will provide a copy of spreadsheet comparing ACH's 481 and IEC's 60286-3 specifications. High-temperature (³150 °C) applications for molded chip tantalums - request a new PN number. Michael Tinkleman to discuss with Ron Gedney the possibility of NEMI participation or a NEMI presentation at a future Engineering Summit. Tantalum chips with Polymer Electrolyte Systems - request a new PN for work on the qualification specification. Need to add all commercially available ratings to the polymer draft specification. Nancy Reynolds will update draft and send to Michael Tinkleman to forward to the rest of P2.5. MSL Information - Dave Toomey will send a note to chairmen of P-2.4, P-3, P-9, and P-10 committees to see what existing MSL information they have, and to see what their interest in developing further MSL information is. Review of EIA Catalog Specification List - see section 2.7 for specifications deleted. Review and update EIA list of Active Projects - see section 2.8 for active projects deleted. This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures. Nancy Reynolds /
Michael Tinkleman, Secretary Return to P-2.5 Main — Top of Page
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