P-2.1 Ceramic Committee Agenda

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P-2.1 Committee on Ceramic and Dielectric Capacitors

Wednesday, April 17, 2002
8:00 am - 10:00 am
Sheraton Old Town Inn

1.0 Membership and Attendance
1.1 Introductions- Circulate Membership Roster
1.2 Approval of Minutes from Fall 2001 Meeting in Philadelphia
1.3 Review of Agenda for Present Meeting
1.4 Correspondence & Review of Committee's Scope
1.5 Report of task groups, committees, and DSCC efforts
1.5.1. DSCC
1.5.2. ACH
1.5.3. Emerging Ceramic Products
1.5.4. U-1

2.0 Old Business
2.1 Status of EIA-595 (SP-4622) - Visual - Mechanical Guide
2.2 Status of Revision of EIA-469-D (PN-4621) -DPA
2.3 EIA-198-F Update
- Part I: Characteristics & Requirements
- Part II: Test Methods (SP-4946) - ANSI Ballot Results to date (Voting period closes 4/23/2001)
- Part III: Individual Specifications
2.4 Review of IEC/EIA 521 (Application Guide for Ceramics) changes for temperature-voltage coefficient-Jim Canner/Dick Thompson
2.5 Status of EIA 198 Changes-Low voltage life test conditions, ac test voltage definitions (cap, DF, ESR?), addition of 0201 size
2.6 Status of ESL Capacitor test method-Jim Canner
2.7 Report from Working Group on RF current and measurement specifications.

3.0 New Business
3.1 Working Group Status Report and proposed agenda items for next meeting

4.0 Time and Place of next meeting

5.0 Adjournment

P-2.1 Working Group Agenda for Monday, 4/15/2002 Meeting - 10am to 3 pm

I. Review topics from the last meeting since many members were not able to attend.
1. Adding Lower Voltages (10, 6.3, 4, 3.3, 2.5)
DF, TCC, VCC Life Test Voltage? (1X or 2X RV)?
2. Standard Capacitor values
3. 0201 case sizes, mechanical, electrical
4. Maximum thickness in larger chip sizes. (1206 and higher)
5. Derating guidelines for ceramics. Review voltage-temp coefficient (VTC) VCC characteristics at 50% RV for example
6. Adding X5R chart to 198 sections 1 and 3. (probably TCC only)
7. 10 uf and higher 100-120 Hz 0.5 volts
8. 0508 low inductance 4-up array mechanical outline
9. Standards for RF current / power dissipation.
9. Power dissipation / max ripple current specs for std case sizes
10.High Frequency Characterization
11.Thickness Relaxation for Extended Values
12.Lead Free Soldering

II. Additional topics for this meeting
1. Capacitor arrays - including ESD reqirements/specs
2. Update on Lead Free Solder topics
3. Consideration of addition of X5R and other dielectrics to EIA-198
4. Low inductance chips for EIA 198 - Case sizes that should be standardized
5. Q factor in EIA 198
6. It was recommended by H. Peterson that we put figure 2: from page 4in Section III/1. This should be moved to section II, 102. This will make it easier to find.
7. Dick Thompson suggests that we break out the last paragraph 1.1.2, the last half of paragraph 1, and the first part of paragraph 2 and put it into a new section numbered 1.1.5 Aging - Class II, III and IV dielectrics.
8. A discussion was held on aging. IEC 384-9 states 1000 hour as the time to reference for cap value.
9. Section 1.1.2 Last paragraph should be rewritten to more accurately describe cautions to be taken during wave soldering.
10. Care will be taken to make sure that all references to C0G in EIA 198 be C0G and not COG.
11. Section 2.2 on marking -
Change wording to be more accurate in Section 1, 2.2. Normally caps are not marked.
When marking is required, refer to EIA 198-3.
12. Discuss references to Mil Std 202 because it doesn't always apply to the wide range of dielectrics and voltages available in the commercial world.
13. Discuss the feasibility of adding pass/fail criteria to EIA/198 Section II. Parts of this section have little meaning without specifying the pass/fail criteria.
14. Continue work started at last meeting on RF (and standard product) current handling capability. We need to standardize testing and power dissipation numbers by case size and possibly dielectric.
15. Discuss X8R specification in light of Low Fire/High Fire dielectrics (PdAu/BME)
16. Discuss substitution of use of "Class I, II, III etc" descriptions instead of calling out specifics for X7R, X8R ect, in all sections of EIA 198.

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