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Minutes of P-2.1 Committee on Ceramic Dielectric Capacitors
October 9, 2002
Marriott City Center, Charlotte, NC

Membership and Attendance

The meeting was called-to-order at 9:00am by Chairman Mike Cannon.

1.0 Introductions- Circulate Membership Roster

- Attendance was taken, and it was determined that a quorum was present.
- Several members were absent due to a conflict with scheduling of an automotive AEC conference - this should be a consideration for future EIA scheduling.

1.1 Approval of Spring Meeting Minutes from Albuquerque, NM
- A correction of EIA-595 status was made (it is ready for publication), and the amended minutes were approved.

1.2 Review of Agenda for Present Meeting
- At the last P2.1 meeting, it was voted and passed to delete the "Emerging Technology" subgroup, and to include any inputs instead under "New Business"
- It was agreed to drop the EIA 469 "Rev C" agenda item, since it is redundant. P2.1 is instead working on revision D, which has never been released.

1.3 Correspondence & Review of Committee's Scope
- Correspondence - None received
- Scope - Continued acceptability

1.4 Report of task groups, committees, and DSCC efforts
1. DSCC (Mike Radecki):
- Handout summarized below (DSCC official copy separately posted on EIA website):
o MIL-PRF-123 (Hi Rel Ceramic) being worked on - possible removal of 100% Sn option, plus "wildcard" termination option. Also working on post voltage conditioning electric testing sequence.
o MIL-PRF-49470 (Switch Mode Power Supply) to add Amendment 2 with low temperature storage requirements and alternate marking for case code 3 parts.
o MIL-PRF-49464 (Single Layer Ceramic) - Reinstated document, since there is now a source interested in qualifying. A draft is out for comments, and is available on the DSCC internet site.
o MIL-PRF-55681 (Military Ceramic Chips) - engineering practices study out for comments and due Oct 19, need input from manufacturers and users (see letter on DSCC website), adding lower voltages/tighter tolerances/smaller cases, adding extended values.
o Considering ultrasonic inspection of hi rel chips - out for comments.
o DSCC internet address is http://www.dscc.dla.mil while many documents are available at http://www.dscc.dla.mil/Programs/MilSpec/DocSearch.asp or at http://astimage.daps.dla.mil/quicksearch/
o Contact: Mike Radecki 614-692-0561 michael.radecki@dscc.dla.mil Fax 614-693-1644
- There was brief discussion on use of 25C for method 305 (similar to EIA method, leading to discussion of whether MIL-STD-202 will be replacing EIA specification.)
- Christine Pollack reported that G11 voted to cancel 87106 , replacing it with MIL-PRF-49470, but user concern exists over whether the current 87106 suppliers were qualified against 49470. Issue not resolved.

2. ACH - Automated Component Handling (Jan Vandenham):
- Jan Vandenham was not present for the current P2.1 meeting.
- Dave Ritchey reported that ACH is still discussing matrix trays, and for a JEDEC presentation.
- Ed Mikoski reported that several interim standards have been changed to EIA standards. EIA-481B (tape/reel) has gone through iteration. Celestica, Solectron, other EMS have commented on problems with multiple orientations of same package from different suppliers, and wanted to clarify orientation rules. IHS is sending out an errata sheet on clarifications. There are to be continued telephone conferences/surveys from task groups - scheduled to be discussed Oct 10.

3. Emerging Ceramic Products
- Subgroup eliminated- Moved to "New Business"

4. U-1 - Steering Committee & User's Group
- No report - committee has not yet met this week
2.0 Old Business
2.1 Status of Revision of EIA-595-A (SP-4622) (Dick Thompson)
- EIA-595 - Ready for review

2.2 Status of Revision of EIA-469-C (Mike Roach):
- Dropped - redundant with revision "D" discussed below
2.3 Status of EIA-469-D (PN-4621) revision balloting (Christine Pollack):
- Christine Pollock is sending an electronic copy to Ed Mikoski so that changes can be reviewed with all P2.1 participants. Rev C focused on small chips, so rev D includes relaxed delamination criteria to accommodate paragraph 5.1.1 a (5 mils or 20% of active area.) Paragraph C was changed to 20% of end margin. Changed APP D to clean up pix and references. This is PN4621, and will be included as an ANSI document. It was moved and passed unanimously to be sent for ANSI public review and balloting.

2.4 Status of EIA-198-F "Ceramic Dielectric Capacitors Classes I, II, III, & IV" (See detail by part section below):
2.4.1 EIA-198-Part I: Characteristics & Requirements- revision balloting status (Mike Lauri):
- Mike Lauri advised that document had been sent out for ballot, with a 50% ballot return rate. This is sufficient to publish after correction. All corrections were editorial, except for one, which was 1.2.1 (mechanical classifications) on soldering methods and thermal shock. For wave soldering, the body size crossover was changed from 1812 to 1210. It was moved and passed unanimously to take the PN balloted document to next stage. A formal SP ballot is not required, since P2.1 approves. The document is ready to go to ANSI public review and balloting.

2.4.1EIA-198-Part II: Test Methods- revision release status (Mike Griffith):
EIA-198 Section II (Test methods)
- Mike Griffith no longer attends P2.1 meetings, so we need a replacement. Jim Canner volunteered to take it over.
- Brian Piscitelli offered to retrieve Mike Griffith's files at KOA.
- This document previously went out for ballot - major comments received - use of MIL-STD-202? Pass/fail criteria?

2.4.2EIA-198-Part III: Individual Specifications- PINS status (Jose Cruz):
- Jose Cruz no longer attends EIA meetings, so we need a replacement.
- Section III pages need many revisions and coordination - there has been considerable effort in the past among many participants.
- Mike Cannon will take out PN's for the ones he has received. The others will need to be addressed at future P2.1 meetings.

2.5 Status of IEC/EIA 521 (Electrical Applications Guide) draft status (Dick Thompson):
- Will add graphs for VCC for 1206/106/6.3/X5R and 0805/105/16/X7R (data from others, or use Kemet competitive info)
- Will make editorial changes/additions for low voltages
- EIA will provide PN number, so it can be sent out for ballot

2.6 Status of ESL Capacitor test method (Karun Mulhotra):
- Low ESL - P2.1 agreed to table this discussion until the next WG meeting - Karun Mulhotra was not in attendance at current meeting.

2.7 Report from Ceramic Capacitor Working Group (earlier meeting of 10/7/02, 10am) (Mike Cannon):
- A longer meeting time for the WG helps to improve the efficiency of the subsequent P2.1 meeting
- Review of discussion on life test voltage - do we need to accommodate different life test voltage ratios for thin sheet, due to differing acceleration factors for thin sheet? Also, discussion on whether to align with IEC, or act independently. The WG needs users' inputs, and few were at the WG meeting, so we deferred further discussion until the next WG meeting, when more users are expected to attend.
- Changed 1812 to 1210 on EIA-198-1 references on wave solder to reflow crossover.
- Postponed discussions on RF and AC test procedures, plus power dissipation and ripple. Carl Postiglione and Karun Mulhotra have been working on this issue, but were unable to attend this meeting. Jim Canner will contact Karun Mulhotra to get a copy of the recommended procedures, and will forward to Ed Mikoski for posting on the EIA website. There was also brief discussion on method - strip line vs. Boonton. EIA-483 needs to be revised or re-affirmed, but it will require significant work, since an electronic original does not exist - a scanned PDF copy is available at EIA or Global HIS.

2.8 Status on search for Committee secretary (Entire P2.1 Committee):
- Continuing search - Terry Charles (Panasonic) says that he might be a possible candidate.

2.9 Status on Electro-static Discharge (ESD) teleconference on circuit protection:
- This topic was originally discussed at previous meetings, and interested companies include Vishay, KOA, Kemet, Murata, AVX, TDK, & Yageo. Conference call has not yet occurred, and the issue could not be discussed among participants since some key participants were not present, due to the scheduling conflict with the automotive AEC conference.
- Mike Cannon agreed to review the history and to set up the call. Participants may want to secure some of the appropriate specs - possibly including IEC 801, EIA 703, AEC 200, JESD22-101, and JESD22-114.
- Automotive influence - scheduling problems with AEC conference

3.0 New Business
3.1 Review of Documents (EIA Spreadsheet)
- While P2.1 removed several PN's last meeting, the need exists for an automatic method for updating the spreadsheet/database.
- A column was added for author (or primary contact), and this needs to be filled out, so that P2.1 members know who to contact for specification issues.
- The entire spreadsheet/database needs to be reconciled with the true current updated status.
- P2.1 was reminded that ANSI will drop standards that have not been re-affirmed within 10 years (5 years is the EIA requirement for standard re-affirmation)

3.2 Working Group status report and proposed agenda items for next meeting.
- Status Reports: Previously detailed in minutes.
- Proposed Agenda Items: Continuation of action items as detailed in minutes
4.0 Time and Place of next meeting
- APR 14-17 @ Tempe, AZ

5.0 Adjournment

This meeting was conducted in accordance with the EIA Legal Guidelines and the Manual of Organization and Procedures.

Mike Cannon,
Chairman
Signature on file

Dave Richardson Secretary
Signature on file

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