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Minutes of P-2.1 Committee on Ceramic Dielectric Capacitors
April 17, 2002
Sheraton Old Town Inn, Albuquerque, NM

Membership and Attendance
1.1 Introductions - Circulate Membership Roster
Attendance was taken, and it was determined that a quorum was present.

1.2 Approval of Previous Meeting Minutes
Minutes from the Fall 2001 meeting in Philadelphia were approved with one correction (addition of Mike Cannon to attendee list).

1.3 Review of Agenda for Present Meeting
Agenda approved with one correction...change the name to "subcommittee" and remove the word "dielectric" from the title. Add election of new secretary to agenda.

1.4 Correspondence & Review of Committee's Scope
None

1.5 Report on task groups, committees, and DSCC
1.5.1 DSCC - Report by Dennis Cross for Mike Radecki. It was suggested by the committee that references to Mil Std 202 be added to EIA 198 where appropriate.

1.5.2 ACH Committee - Did not meet last session due to travel restrictions.

1.5.3 Emerging Ceramic Products - In the future, this item should be removed as a standard agenda item and covered in "New Business".

1.5.4 U-1 Committee - Report given by Dave Richardson for Keith Seamands. Next meeting is scheduled for Charlotte, NC (October 7-10, 2002). Spring of 2003 meeting is planned for Phoenix. Fall of 2003 tentatively planned for San Antonio or New Orleans.

2.0 Old Business - It was suggested that Pass/Fail criteria from Mil 202 (section 2, 108) be added to EIA 198 section III.

2.1 Status of EIA-595-A (SP-4622), "Visual & Mechanical Inspection Multilayer Ceramic Chip Capacitors". Dick Thompson is working on this. A final draft needs to be prepared and then the document will be ready for ballot.

2.2 Status Revision of EIA-469-D (PN-4621), "Standard Test Method for Destructive Physical Analysis (DPA) of Ceramic Monolithic Capacitors"
Christine Pollock has been working on this document. She circulated a draft for review by the subcommittee and explained the changes from previous revisions. Final changes will be made based on the discussion and the document will be sent to Ed Mikoski of the EIA for circulation and ballot.

2.3 EIA 198-F Update, "Ceramic Dielectric Capacitors Classes I, II, III, & IV"
2.3.1 Part I: Characteristics & Requirements - Mike Lauri is working on revisions as discussed by the committee. This revised document is now ready to be sent to the EIA and circulated for ballot before the next meeting (Charlotte, NC Fall 2002).

2.3.2 Part II: Test Methods (SP-4946) - ANSI Ballot Results to date (Voting period closes 4/23/2001) - Mike Griffith will verify negative comments from the recent voting and address any issues at the next scheduled meeting.

2.3.3 Part III: Individual Specifications - Jose' Cruz has this document in electronic form. Mike Cannon will contact Jose regarding the status of the document and will request the initiation of PN numbers (leaded, high voltage SMD, low inductance SMD, and standard voltage SMD) from the EIA so that changes/updates can be made.

2.4 Review of IEC/EIA 521 (Application Guide for Ceramics) changes for temperature-voltage coefficient-Jim Canner/Dick Thompson
Update from Dick Thompson - the document was cut and paste. He has scanned the original document and has retyped text to get it to an electronic version. He will add additional VCC information for low voltage parts and additional dielectrics. Members will send typical data to Dick. He hopes to send it out and for comments and have it for voting at next meeting. Carl Postiglione, M. Greenwood, D. Ritchie and C. Reynolds volunteered to review a draft of this spec when it is sent out from Dick Thompson.

2.5 Status of EIA 198 Changes-Low voltage life test conditions, ac test voltage definitions (cap, DF, ESR?), addition of 0201 size
This item was discussed extensively at Working Group. Carl Postiglione and Karun Malhotra will work jointly to look at life test voltages and discuss it further at the next Working Group meeting. Dick Thompson will invite John Prymak to join on this project.

2.6 Status of ESL Capacitor test method-Jim Canner - This document has been in a draft stage for some time. Mike Cannon will check with Jim C. and Karun M. to see if it makes sense to activate it again.

2.7 Report from Ceramic Capacitor Working Group
The following agenda items were discussed at the working group meeting held Monday, 15 April 2002.

P-2.1 Working Group Agenda for Monday, 4/15/2002 Meeting - 10am to 3 pm

I. Review topics from the last meeting since many members were not able to attend.

1. Adding Lower Voltages (10, 6.3, 4, 3.3, 2.5) DF, TCC, VCC Life Test Voltage? (1X or 2X RV)?

2. Standard Capacitor values

3. 0201 case sizes, mechanical, electrical

4. Maximum thickness in larger chip sizes. (1206 and higher)

5. Derating guidelines for ceramics. Review voltage-temp coefficient (VTC) VCC characteristics at 50% RV for example

6. Adding X5R chart to 198 sections 1 and 3. (probably TCC only)

7. 10 µf and higher 100-120 Hz 0.5 volts

8. 0508 low inductance 4-up array mechanical outline

9. Standards for RF current / power dissipation.

10. Power dissipation / max ripple current specs for std case sizes

11.High Frequency Characterization

12.Thickness Relaxation for Extended Values

13.Lead Free Soldering

II. Additional topics for this meeting
1. Capacitor arrays - including ESD requirements/specs

2. Update on Lead Free Solder topics

3. Consideration of addition of X5R and other dielectrics to EIA-198

4. Low inductance chips for EIA 198 - Case sizes that should be standardized

5. Q factor in EIA 198

6. It was recommended by H. Peterson that we put figure 2: from page 4in Section III/1. This should be moved to section II, 102. This will make it easier to find.

7. Dick Thompson suggests that we break out the last paragraph 1.1.2, the last half of paragraph 1, and the first part of paragraph 2 and put it into a new section numbered 1.1.5 Aging - Class II, III and IV dielectrics.

8. A discussion was held on aging. IEC 384-9 states 1000 hour as the time to reference for cap value.

9. Section 1.1.2 Last paragraph should be rewritten to more accurately describe cautions to be taken during wave soldering.

10. Care will be taken to make sure that all references to C0G in EIA 198 be C0G and not COG.

11. Section 2.2 on marking - Change wording to be more accurate in Section 1, 2.2. Normally caps are not marked. When marking is required, refer to EIA 198-3.

12. Discuss references to Mil Std 202 because it doesn't always apply to the wide range of dielectrics and voltages available in the commercial world.

13. Discuss the feasibility of adding pass/fail criteria to EIA/198 Section II. Parts of this section have little meaning without specifying the pass/fail criteria.

14. Continue work started at last meeting on RF (and standard product) current handling capability. We need to standardize testing and power dissipation numbers by case size and possibly dielectric.

15. Discuss X8R specification in light of Low Fire/High Fire dielectrics (PdAu/BME)

16. Discuss substitution of use of "Class I, II, III, etc." descriptions instead of calling out specifics for X7R, X8R, etc., in all sections of EIA 198.

The following are notes from the Working Group Meeting:
Reviewed PN numbers
Suggested that a name be associated with each project (PN)
198 Part I F - Mike Lauri - PN 4979
198 Part II - Mike Griffith SP 4946 (received unfavorable ballott)
Assign new PN number- 198 Part III - Jose' Cruz-
EIA 469 Rev D draft - Submitted by Christine Pollock - (PN 4621)
EIA 521 Electrical - Dick Thompson
EIA 595 Visual & Mechanical -Dick Thompson

We need a clean list of PN's that we are working for the upcoming P2.1 meeting on Wednesday.

IEC voltages 1.0, 1.25, 1.6, 2.0, 3.15, 4.0, 5.0, 6.3 and 8.0 (IEC document 60384-1 and -10)

Suggested that we stick with 4.0, 2.5, 1.6, and 1.0 volts

Discussion of life test voltages.

Cap Values - Mike Lauri is changing cap values in Section 1 tale 4 for standardization.

Some members feel we need a VCC specification...or at least a minimum value.
Dick Thompson will make curves for additional low voltages for EIA 521 applications guide. Suppliers are urged to provide Dick with characteristics for their products.
A PN needs to be issued to change this specification.

Contact Brian Piscitelli for 0805 outline for 4 up array. Mike Lauri will work on this to suggest an outline. Similar to SOCM type. Also data will be accumulated for an 0402 array.
Mike Cannon will start a PN for this project.

It was brought up that we should spend more time looking at ESD requirements/specifications. A teleconference should be set up before the next meeting to organize a task force to discuss ESD issues for ceramic capacitors.
Lauri, Thompson, Malhotra, Postiglione, Cannon

We should up date slash sheets for update/inclusion of low inductance (0612 and 0508)
Canon will follow up with Jose Cruz.

Section III/1 page 4 table 2. (Q factor) will be moved by Mike Griffin to Section II, Method 102.

Slight change in Section 1.1.2 for class II dielectrics to accommodate "referee time" for cap measurement.

Section 1.2.1 was rewritten by Mike Lauri to address cautions to be taken during wave soldering. This addresses wave solder caution for 1812 and above sizes.

The next revision of 198 section 1.1.2 so that caps are not typically required to be marked.

Pat Kyne with DSCC is revising a few of the Mil Std 202 methods. There will be a hand out of this draft spec in the P-9 meeting.

Karun Malhotra gave update on methods for power dissipation measurements/specifications

Carl Postiglione gave an update on AC measurements for ceramics.

3.0 New Business:

3.1 Dave Richardson is stepping down as secretary of the P2.5 group. A successor was not named at this meeting but several members offered to take the minutes at upcoming meetings on a "meeting by meeting" basis.

3.2 The following PN numbers will be removed from the active list:
PN 1631, 1632, 1634, 1635, 1637, 1739, 1740, 3563, 3881, 2018. Also a column will added for responsible person's name on next revision of "active projects" list. Motion was made and passed.
3.3 ED Mikoski will arrange an ESD teleconference. This should be organized to look at industry requirements and discussed recommended test methods. There is a JEDEC spec JESD 22-A114. JEDEC.org web site. Carl P, D Thompson, Mike Griffith, C. Reynolds, Mike Cannon, Karun Malhotra volunteered to participate.

4.0 Next Meeting
The next meeting will be at the ECA Fall Engineering Summit the week of 07-10 October 2002 at the Downtown Marriott in Charlotte, NC.

5.0Adjournment
The meeting was adjourned at 10:00am.

This meeting was conducted in accordance with the EIA Legal Guidelines and the Manual of Organization and Procedures.

Mike Cannon,
Chairman
Signature on file

Dave Richardson Secretary
Signature on file

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