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Home > Technology Center > Engineering Committees > P-10 Committee Minutes
of P-10 Committee on Integrated Passive Devices
Self-introductions
were made. Attendance was taken, and it was determined that a quorum was present. 2.2 Approval
of Agenda 2.3 Approval of April 5, 2000 Meeting Minutes Motion carried approving the April 2000 minutes. 2.4 Correspondence No correspondence. Draft specification
has been developed. Committee unanimously agreed that the RC Test Performance
Specification should be balloted. 3.2 Review IPD Circuit Registration Requests No requests have been received to date. California Micro Devices has several they are planning to file. Now required to have two companies - supplier / user for an IPD registration. Expect will have some to report at the next committee meeting. 3.2.1 Committee ECA Web Discussion ECA web site was
demonstrated. Committee chairman would like to see committee minutes,
roster, work in progress, and a forum for messages on the ECA web site.
Action Item This topic will be discussed further at the Tuesday U-1
meeting. This has been a committee discussion item for the last 18 months. Chairman will provide a spreadsheet by supplier on IPD chip scale test requirements. Action Item The spreadsheet should then be put up on the ECA web site. Reference was made to AECQDF200 - GM/Chrysler/Ford joint component specification for all suppliers. (includes chip scale) Goal is to try and identify the defect mechanisms they are looking for. 4.0 New Business
Chairman Krystek indicated that it would be desirable to switch from a user to a supplier as chairman. Jose Cruz nominated Michael Griffith, KOA Speer. Michael Griffith was elected chairman unanimously. John Jorgensen, California Micro Devices was elected vice-chairman. 4.2 Other Business A memo from the IEC TC-40C Technical Advisor, Bill Carrier, was circulated. It covering a document sent out by the IEC TC-40 chairman on "Passive Components - an overview of the emerging technologies" which has already been submitted to the IEC approval system as a new work item proposal. Most of the materials are from the NEMI passives Roadmap section. The committee felt that it was important that they be made aware of these types of documents as they are being developed. 5.0 Next Meeting The next Engineering Summit will be 4/23-25/2001 in San Antonio. 6.0 Adjournment The Committee moved, seconded, and unanimously agreed to adjourn at 3:24 PM. 7.0 Action Items RC Test Performance Specification - Ram Swamy will provide a clean copy to Chairman and Michael Tinkleman. PN Number will be assigned. Specification will be balloted. ECA web site - Committee chairman would like to see committee minutes, roster, work in progress, and a forum for messages. Chip Scale Package Test / Qualification Requirements - Chairman will provide a spreadsheet by supplier on IPD chip scale test requirements. This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures. Paul Krystek, Chairman Michael Tinkleman,
Secretary
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