Electronic Components, Assemblies & Materials Association

Committees

P-10 Integrated Passive Devices

Next Meeting: October 6-9, 2008 Salt Lake City, UT

Meeting Date Notice Agenda Roster Minutes Attachments
April 1, 2008   04/01 (PDF)      
September 25, 2007   09/25 (PDF)   09/25 (PDF)  
April 17, 2007   04/17 (PDF)   04/17 (PDF)  
September 25-29, 2006   09/26 (PDF)   09/26 (PDF)  
April 25, 2006   04/26 (PDF)   04/26 (PDF)  
October 17-20, 2005   10/18 (PDF)   10/18 (PDF)  
May 17, 2005   05/17 (PDF)   05/17 (PDF)  
October 5, 2004   10/05 (PDF)   10/04 (PDF)  
April 19-22, 2004   04/19-22 (PDF)   04/19-22 (PDF)  
October 6, 2003
10/06 (PDF)
April 15, 2003
October 8, 2002
10/08
10/08
April 16, 2002
October 9, 2001
April 23, 2001
October 2, 2000
10/02(PDF)
April 5, 2000

 

Committee Scope: Will provide technical support and develops standards and specifications for electronic devices using mixed passive product technologies and diodes that perform a passive, (but not limited to) e.g., a) resistors and capacitors; b) resistors and diodes; c) resistors, capacitors, and inductors.These devices may be discrete components that are "integrated" on a common substrate (hybrid) or in a carrier formed by a common manufacturing process (monolithic). Activities also include the generation of terms and definitions, review of specifications, establishment of new specification criteria, and maintenance of existing criteria relating to these devices. To accomplish these functions, the committee maintains liaison with and uses technical information from other standards development organizations (SDOs), government agencies, industry, various professional organizations, participating members, and guests.

Downloads: Active Projects (PDF), Chipscale Network Qualification (Word)