CE-2.0 National Connector and Socket Standards

Next Meeting:April 27-30, 2009 New Orleans, LA

Meeting Date	Notice	Agenda	Roster	Minutes	Attachments*
April 28-29, 2009		04/28-29 (PDF)		04/28-29 (PDF)	Attachment 1 Attachment 2 Attachment 3 Attachment 4 Attachment 5 Attachment 6 Attachment 7 Attachment 8 Attachemnt 9 2.1 Agenda 2.2 Agenda
October 6-9,2008		10/6-9 (PDF)		10/6-9 (PDF)	Attachment 1 Attachment 2 Attachment 3 Attachment 4 Attachment 5 Attachment 6 Attachment 7 2.1 Agenda 2.2 Agenda
March 28 - April 1, 2008		03/28-4/1 (PDF)		03/28-4/1 (PDF)	Attachment 1 Attachment 2 Attachment 3 Attachment 4 Attachment 5 Attachment 6 Attachment 7A Attachment 7B Attachment 8 Attachment 9 Attachment 10 Attachment 11 Attachment 12 Attachment 13 2.1 Agenda 2.2 Agenda
September 24-27, 2007		09/24-27 (PDF)		09/24-27 (PDF)	CE 2.2 Minutes CE 2.1 Minutes EIA Contact List ASTM Report NAVAIR Report DSCC Report CE 2.3 Report 2.1 Agenda 2.2 Agenda
April 16-19, 2007		04/16-17 (PDF)		04/16-17	CE 2.2 Minutes CE 2.1 Minutes EIA Contact List IEC Report DSCC Report ASTM Minutes ASTM Agenda NAVAIR Report 2.1 Agenda 2.2 Agenda
September 25-29, 2006		09/25-29 (PDF)		09/25-29 (PDF)	2.1 Minutes 2.9 Minutes EIA Contact List DSCC Report 2.6 Report SAE Meeting Agenda SAE Report ASTM Report 2.1 Agenda 2.9 Agenda
April 24-27, 2006		04/24-27 (PDF)		04/24-27 (PDF)	2.1 Minutes 2.9 Minutes EIA Contact List DSCC Report 2.6 Report SAE Report ASTM Report 2.1 Agenda 2.9 Agenda
October 17-20, 2005		10/17-18 (PDF)		10/17-18(PDF)	CE 2.1 Minutes CE 2.9 Minutes EIA Contact List EIA 622 Report DSCC Report SAE Report IEC Report2.1 Agenda 2.9 Agenda
May 16-17, 2005		05/16 (PDF)		05/16 (PDF)	2.1 Minutes 2.9 Minutes DSCC EIA 364 DSCC Project Status SAE Mtg. Report SAE Liaison Report IEC Trip Report ASTMB021 EIA Contact List MVD Summary 2.1 Agenda 2.9 Agenda
October 5, 2004		10/05 (PDF)		10/05 (PDF)	2.1 Agenda 2.1 Minutes 2.9 Minutes
April 19-22, 2004		04/19-22 (PDF)		04/19-22 (PDF)	2.1 Minutes 2.9 Minutes IEC Trip Report
October 8, 2003	10/08	10/08		10/08 (PDF)	Registration Form
May 12-13, 2003	5/12-13	5/12-13	5/12-13	5/12-13	Attachments 1-2
November 6-7, 2002	11/6-7	11/6-7	11/6-7	11/6-7	Attachments 1-3
April 17-18, 2002	04/17-18	04/17-18	04/17-18	04/17-18	Attachments 1-13
October 16-17, 2001	10/16-17	10/16-17	Rescheduled	Rescheduled	—
June 5-6, 2001	6/5-6	6/5-6	6/5-6	6/5-6	Attachments 1-7
February 27- March 1, 2001	2/27-3/1	2/27-3/1	2/27-3/1	2/27-3/1	Attachments 1-15
October 31- November 2, 2000	10/31-11/2	10/31-11/2	10/31-11/2	10/31-11/2	Attachments 1-12

 

Committee Scope: The scope of the EIA CE-2.0 National Connector and Socket Standards Committee is to provide industry leadership in defining the performance tests, and the mechanical and electrical characteristics of all electronic connector products (typically referred to as "two-piece connectors").These efforts are critical in ensuring robust commercial viability for such innovative products to enter the marketplace by ensuring interchangeability of parts between multiple manufacturers of a particular product. Liaison with other EIA committees, industry standards groups (such as SAE), trade groups (such as SFF) and the military is also a charter requirement. Typical products this committee standardizes are backpanel connectors, board-to-board connectors and board-to-cable connectors. Some industry examples are as follows:

Backpanel Connectors
Blade and Tuning Fork Connectors
Printed Board Connectors
Rectangular Connectors
Circular Connectors

Through Sub-committees, the group also addresses industry test methods, terminology, plating issues, material issues, etc. The documents created will become accredited National Industry Standards (ANSI). Test schedules presented in such documents may be used for qualification testing.

Documents for products with international interest are submitted to the IEC (International Electrotechnical Commission) for acceptance as IEC standards.

*Note: All attachments are PDF files unless noted otherwise

Committee Chairman: Frank Ruffino, Molex Inc.

Roster:

Member - Voting	Member - Non-Voting	Distribution List
Ralph Antonelli Defense Supply Center Columbus David Bouzek Tri Star Electronics Greg Brown Glenair, Inc. Don Chambers Northrop-Grumman Alan Davis Amphenol Corporation Robert Druckenmiller FCI USA, Inc. Carl Fritz Consultant H. John Healey IBM Corporation Max Peel Contech Research, Inc. Kevin Rickard Amphenol Corporation Frank Ruffino Molex Inc.	Bernie Aronson Bobby Crumb Imco Jack Gentry Positronic Industries , Inc. Tim Kepley Positronic Industries, Inc. Patrick Oakes Glenair, Inc. Arnold Offner Phoenix Contact Thomas Peel Contech Research, Inc. William Peverill Delsen Testing Laboratories Dennis Smith Tyco Electronics Dwight Tabit Naval Air Warfare Center NAWC Jeffrey Toran FCI USA Inc. William Upstone ITT Industries Cannon Division Trevor Williams QinetiQ Cecelia Yates ECA	Roger Mathews PPC

To review or edit individual roster profiles, click here.
Note: Individual ID and password required.

To request to participate or receive information on this committee, please click here.