ECA | Electronic Components Association

 

COMMITTEES


Fall 2011 Standards Engineering Summit
Portland, Oregon
September 19-22, 2011

The Fall Standards Engineering Summit will be held September 20-22 in Portland, Oregon. This semi-annual event features a complete slate of EIA engineering meetings plus a series of general sessions and participation activities that will allow attendees to meet and exchange information with colleagues and peers. A special seminar has been added to Monday, geared to first-time attendees. The Summit chairmen in conjunction with the S-1 General Session have provided a schedule that will both meet the objectives of each attendee and still allow enough time to assure a productive and efficient venue for all technical activities.

ACTIVE COMMITTEES

S-1 Committee (formerly U-1)
S-1 Passive Component Committees Steering Group

P Committees
P-1 Resistive Devices
P-2.1 Ceramic Dielectric Capacitors
P-2.2 Paper, Film, Mica & Wet-Electrolytic Capacitors
P-2.5 Solid Electrolytic Capacitors
P-2.7 Electrochemical Double-layer Capacitors
P-3 Inductive Components
P-4 Mechanical Outlines
P-10 Integrated Passive Devices
P-14 Overcurrent Protection Devices

Connector Committees
CE-2.0 National Connector and Socket Standards
CE-4.0 RF Connectors
CE-4.1 Rigid Coax

Department Committee
Automated Component Handling
Soldering Technology
STPC

STANDARDS LIBRARY
Password required
EIA 364

 

IEC Quality Assessment System for Electronic Components (IECQ)
EIA Documents

INACTIVE COMMITTEES

P Committees
P-2x Capacitive Components
P-7 Conductive Components
P-9 Test Methods & Procedures
P-11 Quartz Crystals
P-12 Relays
P-13 Switches


Connector Committees
CE-5.0 Racks & Panels

Cathode Ray Tubes
JT Committees on CRTs