Program

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Schedule

Monday, April 26
9:00 am - 4:00 pm	Registration
9:00 am - 5:00 pm	VECI
9:00 am - 12 Noon	Ceramic Working Group
12 Noon - 1:00 pm	Box Lunch
1:00 pm	Tantalum Working Group
6:30 pm - 8:00 pm	Welcome Reception (open to all attendees)
Tuesday, April 27
7:00 am -9:30 am	Continental Breakfast
7:30 am - 4:30 pm	Registration
8:00 am - 10:00 am	S-1 General Session
9:00 am - 5:00 pm	CE-2.0 National Connector Standards
9:00 am - 5:00 pm	VECI
10:00 am	Refreshment Break
10:00 am - 11:00 am	P-1 Resistive Devices P-10 Integrated Passive Devices
11:00 - 12 Noon	TC-40 TAG
Noon - 1:30 pm	Lunch
1:30 pm - 3:30 pm	Soldering Technology (STC)
3:30 pm	Refreshment Break
4:30 pm - 6:30 pm	P-4 Mechancial Outlines
7:00 pm -8:30 pm	Dinner
Wednesday, April 28
7:30 am - 9:30 am	Continental Breakfast
7:30 am - Noon	Registration
9:00 am - 5:00 pm	CE-2.0 National Connector Standards
8:00 am -10:00 am	P-2.2 Paper, Film, Mica & Wet Electrolytic Capacitors
10:00 am - 11:00 am	P-3 Inductive Components
10:00 am	Refreshment Break
11:00 am - Noon	P-2.1 Ceramic Capacitors
Noon - 1:30 pm	Luncheon Awards
1:30 pm - 2:30 pm	P-2.5 Solid Electrolytic Capacitors
2:30 pm - 3:30 pm	P-2.7 Electric Dual Layer
3:30 pm - 5:30 pm	Standards & Technology Policy Council (STPC)
	Dinner on Own
Thursday, April 29
8:00 am - 5:00 pm	Automated Component Handling (ACH)