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Home > Technology Center > Engineering Committees > P-2.1 Committee P-2.1 Committee on Ceramic and Dielectric Capacitors Mon., 3 April 2000
1 Committee organization and procedures 1.1 Membership
and attendance 1.2 Approval
of the Agenda 1.3 Approval
of the Minutes 1.4 Correspondence
1.5 Review of
the Committee's scope 2.0 Report of task groups, committees and DSCC activity 2.1 DSCC: Ken Bernier passed out activity sheet which is attached to these minutes (attachment A). 2.2 ACH: Bulk Case was approved based on EIA-J and IEC documents. EIA 481-2 and 481-3 are being recombined into 384-1 to make one taping specification. 2.3 Emerging Cap: Jim Canner gave The Summary of EIA-J RC2324 for low voltage and high cap values. It is shown in attachment B 3.0 Old business 3.1 EIA 595: Visual Mechanical Guide. Not sent out for ballot because no records of committee vote was found in the minutes. Motion was made and seconded to accept draft and send out for ballot. The committee voted unanimously to pass the motion. ACTION: Send out Draft copy of EIA 595 for ballot. 3.2 EIA 469C: DPA guide. The draft was reformatted by EIA and will be sent to Christine Pollack and Mike Roach for editorial review. The draft will then be sent out for balloting as voted in the last meeting. ACTION: Send draft to Christine Pollack and Mike Roach for review. Then send out for ballot. 3.3 EIA 198-F : 3.3.1 Section 1: Was not sent to committee for review as requested . Will send out for electronic committee ballot and then for ANSI ballot. 3.3.2 Section 2: Will renumber and reissue with no changes. A task group consisting of Ian Murdock, Mike Cannon, Dick Thompson, Jim Canner and Mike Griffin was formed to review test methods and update them as needed. Mike Griffin to be Section 2 team lead. 3.3.3 Section 3: Will incorporate the three slash sheets for High Voltage, Low ESL and Cap Array and send out for committee review. A task group consisting of Jose Cruz, Chris Reynolds, Dick Thompson, and Christine Pollack was formed to expedite the incorporation of the slash sheets and review the editorial content for accuracy before ballot.. Jose Cruz to be Section 3 team lead. 3.3.4 Section 4: Vishay Vitramon was not present. Mike Lauri will inquire if they have any action for adding Qualification procedure to Section 4. 3.3.5 Bulk Case Chip Dimension: Harold Peterson requested that the tighter tolerances be added as a separate dimension table to slash sheet EIA 198-3-3-F 3.4 Temperature - Bias Voltage Coefficient. No progress was made, Dick Thompson to look into adding the information into Application Manual EIA 521. ACTION: EIA to send Dick Thompson soft copy of EIA 521 for updating. 3.5 Low ESL Capacitor Test Method. Jim Canner handed out revised copy with response to comments from Philips and TDK. Chris Reynolds informed group that they had mad response, but it was not received by Jim Canner for incorporation.. Another copy was sent and another draft will be made with email review and comments before submitting to committee for ballot. 4.0 New Business 4.1 New Chairman: Mike Cannon was voted to take over the chairman position. 4.2 Review of Old Documents: 4.2.1 EIA 483 was reaffirmed unanimously. There were no technical comments. 4.2.2 EIA 521 will be sent to Dick Thompson for review 4.2.3 All other documents were acted on at the last meeting and are noted in the minutes. 4.3 Agilent Presentation: Jan Bradshaw presented information on new test fixture for High frequency measurements with very good repeatability. Presentation is Attachment C. 4.4 Longer Meeting Time: Suggestion was made by Casey Crandall that the meeting time be longer so that technical activities will be finished sooner. Request will be made at U-1 meeting for 8-hour time allocation. 4.5 Lead Free Issues was referred to U-1 meeting. 5.0 Time and Place of Next Meeting: Refer to U-1 meeting minutes. 6.0 Adjournment: Meeting was adjourned at 4:25 p.m. 7.0 Action items for EIA Engineering (Bernie Aronsen) 7.1 Send EIA
595 out for ballot. This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.
Appendix
A MIL-PRF-49470
Ceramic Switch Mode Power Supply Capacitor MIL-PRF-55681
Ceramic Multiple Layer Chip MIL-PRF-49467
Ceramic High Voltage Other document
actions in Process Documents Released
Sources for Free
Download of Military Documents Contacts
Appendix
B -Capacitor > 10
µF is tested at 100 ~ 120 Hz with 0.5 +/- 0.2 Vrms Summarized by Jim Canner, Murata Electronics.
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