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Minutes of the CE-3.0 National Socket Standards Committee
August 13, 2001
Baltimore, MD

II. Approval of Minutes
The meeting was called to order at 8:45 AM. The minutes of the May 7, 2001 meeting were reviewed with no noted corrections. Mr. Fritz motioned to accept the minutes as written. This was seconded by Mr. Tom Peel, and unanimously approved.

III. Chairman's Report
Harvey read a letter from Mr. Michael Tinkleman (Manager of Engineering Services) indicating that he will be leaving ECA/EIA as of 24 July 2001.

Harvey read a letter from Bob Willis indicating that Mr. Ed Mikoski will assume the position vacated by Mr. Tinkleman in addition to his current position at EIA.

Harvey reported that the interest JEDEC had in having this committee prepare envelope socket specifications for newly issued microelectronics packages has appeared to have evaporated for
60690:9/01
the time being. Harvey indicated that he would contact Mr. Martin Freedman (JEDEC) and discuss this further as an action item.

IV. Project Reports
Published Documents
1. SP-4332: Detail Specification, Coin Cell Battery Holder. Issued June 2001 as EIA-540J0AB.

EDEC Ballots
1. SP-3877A-1: Specification for SFF 5.25" Disk Drives. EIA-741. Submitted to HQ on 4/24/01.

Harvey called EIA during the meeting for a status on this ballot. Cecelia Williams indicated that it was supposed to be sent out on 7 May 2001 as a 30 day SP ballot, however it was never distributed by Global. It will be sent out again.

Reaffirmation
1. SP-4109: Detail, 50 mil, angled SIMM (EIA-540FAAD). Ballot issued 5/24/01, expires 7/24/01.
No negative comments have been received as of the meeting. If none are received, document will be forwarded to EDEC.

2. SP-4110: Detail, 50 mil, vertical SIMM (EIA-540FAAC). Ballot issued 5/24/01, expires 7/24/01.
No negative comments have been received as of the meeting. If none are received, document will be forwarded to EDEC.

3. SP-4970: Reaffirmation EIA-540DAAA-A: Detail, DIP.
The SP ballot for reaffirmation was issued on 27 June 2001, with an expiration date of 27 August 2001. Any comments received will be discussed at our next meeting.

4. SP-4971: Reaffirmation EIA-700A0AB: 68-pin Memory Card Connector.
The SP ballot for reaffirmation was issued on 27 June 2001, with an expiration date of 27 August 2001. Any comments received will be discussed at our next meeting.

Pink Sheet Ballots

1. SP-3874: Detail, SODIMM. Tyco. New draft needed.
Deferred, since no representative from Tyco was present. Issue to be addressed at the next meeting. Carl Fritz offered to contact Mr. Vince Pascucci and check on the status of this project.

2. SP-4251: Rev. EIA-540B0AA. Detail, BGA, High Pin Count. Contech Research. Ballot expires 8/13/01.
Comments received from Harvey Waltersdorf are as follows:
- Page 2 under socket outline drawing. Change "were" to "where".
- Page 2 under product description. The box "REQUIRED INFORMATION" will instead refer to a new annex F. The statement will now read: "This specification is for use with BGA devices described in annex F
- Add new informative annex F
- Page 13, Change "LGA" in note 2 to "BGA" to correct typo.
- Page 15, Change reference to "See note 1" to "See note" under severity or condition of test on test phase DP1 and DP2.
- Page 3, clause 3.1 change "gold or tin-lead" to "tin-lead or a finish compatible with tin-lead".

Comments presented by Carl Fritz (FCI) on his favorable ballot were discussed. Carl Fritz accepted the explanations on each item that resulted in no change to the specification. The comments essentially were withdrawn by Carl Fritz.

The committee unanimously moved to incorporate these comments and approved sending the specification to EIA for EDEC ballot. The comments received on the SP ballot were discussed at the meeting and considered editorial or for clarification, including the addition of informative annex F.

3. SP-4965: Rev. EIA-540B0AE: Detail Land Grid Array. Contech Research.
Tom Peel reviewed his latest draft of the specification. Based on input at the meeting Tom will revise the draft. This specification has already been approved for SP ballot at the January 2001 meeting.

Draft Documents
1. PN-4114: Rev. EIA-540FA00, (Streamlined) Blank, Multi-Package Modules. Molex. Draft needed.
No report given since the author was not present. The author will revise the standard based on earlier discussions on creating IS standards to accelerate the standards development process.

2. PN-4972: EIA-540B0AD: Low Pin Count LGA. Contech Research.
Tom Peel informed the committee on the current progress to develop this specification. LGAs are more complex than BGAs. Tom has identified three different actuations for LGA products. A new one is what he terms "compression fit" which may cause some changes in resistance values. His goal is to have a draft for pink sheet distribution by early November.

3. PN-4973: EIA-540B0AB: Low Pin Count BGA. Contech Research.
Tom Peel informed the committee on the current progress to develop this specification. His goal is to have a draft for pink sheet distribution by early November.

Five Year Review Ballots:

1. EIA-5400000-A: Generic. Ballot expires 7/25/01.
It was decided that since this document is the basis for all other CE-3.0 documents, and that it is in need of updating, that it should be a committee effort. Harvey will contact Ed Mikoski of EIA to see if there are any other generic documents from other EIA committees, or any guidance documents that we should be comparing. It is realized that the NECQ System no longer exists and the standard will need considerable rework. Harvey will also contact the chairman of EIA-CE.2.0 to see if the two committees can work on both generic documents at the same time since EIA-7000000 (the basis document for CE-2.0) is also due for reaffirmation and contains many of the same issues. A possible combined Working Group could be established to accomplish this task. Harvey will request a PN number from EIA to revise EIA-5400000 in the interim.

2. EIA-540BAAA-A: Detail, Mech. PGA. Ballot expires 7/25/01.
Harvey has agreed to work with Tom Peel to revise this specification. Some items to be addressed are:
· Revision of vibration levels
· Removal of NECQ references
· Removal of part numbers
· Removal of porosity testing
· Addition of mixed flowing gas
· Addition of heat sink mass values
· Removal of performance levels
· Addition of interstitial patterns
· Addition of JEDEC drawing references.

Tom Peel will be responsible for revising the testing sequences to comply with current practices. Harvey will request a PN number from EIA to revise EIA-5400000 in the interim.

V. Five Year Review
No new items at this time.

VI. New Business
Memory Card Sockets
On hold for now.

Connector Specifier article
Harvey presented a draft of an article that he would like to have published in the "Connector Specifier" magazine on behalf of the CE-3.0 committee. He will send it to Mr. Ed Mikoski (EIA) for review. It is felt that this article will publicize the work of the CE-3.0 committee and EIA.

VII. Old Business

VIII. Future Meeting
14 and 15 January 2002, Tampa, FL area

IX. Adjournment
The meeting adjourned at 4:30 PM by unanimous approval.

This meeting was conducted in accordance with EIA Legal Guidelines and the EIA Manual for Organization and Procedure.

Harvey R. Waltersdorf, Chairman

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