Session 1:  Passive Components for Harsh Applications
Chairman: Dave Richardson, Vishay

Recent Trends and Developments in Passive Component EMI Filters for Active Implantable Medical Devices; (view abstract)
Prof. B. Stevenson, Greatbatch Technologies Inc.

Capacitor Selection in Aviation Equipment;
S. Gu, L-3 Communication (view abstract)

Aluminum Oxynitride Capacitors for Multilayer Devices with Higher Energy Density and Wide Temperature Properties; K. Bray, K Systems Corp. (view abstract)

Diamond-Like Carbon Capacitor for High Energy Density and High Temperature Operation; S. Carr, U.S. Air Force (view abstract)

Hybrid Capacitor Assembly Qualification;
N. Clark, Sandia National Labs (view abstract)

Aluminium Electrolytic Capacitors' Performance in Very High Ripple Current and Temperature Applications; L. Eliasson, Evox Rifa AB  (view abstract)

Session 2: Designing for Computer and Consumer Applications           
Chairman: Prof. Bob Stevenson, Greatbatch Technologies

Power Delivery Challenges for Multi-Core Microprocessors; (view abstract) 
L. Mosley, Intel Corp.

Tantalum Capacitor Benchmark in Audio Portable Applications;  R. Faltus, T. Zednicek, AVX Czech Republic; I. Smith, Wolfson Microelectronics plc (view abstract)

Efficient, Stable, and Reliable Tantalum Capacitors; Y. Freeman, P. Lessner, Kemet Electronics (view abstract)

Decoupling Solutions; J. Prymak, E. Reed, R. Hahn, M. Randall, P. Blais, B. Long, Kemet Electronics (view abstract)

Battle for Volumetric Efficiency: When Technologies Compete Customers Win;  R. Hahn, Kemet Electronics (view abstract)

Film Capacitor Thermal Strategies Increase Power Density; 
R. Kerrigan, NWL (view abstract)

Advanced Multilayer Capacitors Using High Energy Density Antiferroelectric Ceramics; W. Hackenberger, TRS Technologies Inc. (view abstract)

Session 3: Unique Electronic Design Approaches
Chairman: Douglas Edson, AVX

Role of Wireless Modules, Using Embedded Passives, in The Expansion of Wirelss Connectivity Solutions ; (view abstract) J. Kolbe, Murata North America

Why That 47 uF Capacitor Drops to 37 uF, 30 uF, or Lower; J. Prymak, M. Randall, P. Blais, B. Long, Kemet Electronics (view abstract)

The Growing Importance of Inductance in Tantalum Capacitors; E. Reed, KEMET Electronics (view abstract)

Printable Film Sensors;
W. Mathias, MicroPen Technologies Corp. (view abstract)

Fabrication and Characterization of Nanolayer Capacitors; R. Chow, LLNL (view abstract)

High Voltage Solid Polymer Tantalum Capacitors; J. Young, J. Qiu, R. Hahn, Kemet Electronics (view abstract)

Electrochemical Reactions on Graphite Cathodes in High-Voltage Capacitors; J. Hossick-Schott, Medtronic Energy and Components (view abstract)

Session 4: Advanced Testing and Reliability     
Chairman: Randy Townley, Lockheed Martin Co.

Process Development with Temperature Sensitive Components in Server Applications; (view abstract) L. Pymento, W. Davis, M. Kelly, M. Cole, J. Wilcox, P. Krystek, C. Grosskopf, IBM Corp.

An Advanced Test Solution for Relay Stick, Miss, and Functional Testing, Reflex 40 ;  S.J. Hobday, Applied Relay Testing Ltd. (view abstract)

Effect of Surge Current Testing on Performance and Reliability of Solid Tantalum Capacitors;  A. Teverovsky, Perot Systems/GSFC (view abstract)

Construction improvement for anti-sulfuration chip resistors;
C. Huang, Huawei Technologies Co. Ltd.  (view abstract)

Niobium Oxide and Tantalum Capacitors:  Leakage Current, Restoring Voltage and Reliability; J. Sikula, V. Sedlakova, H. Navarova, J. Hlavka, Brno University; M. Tacano, Meisei University;  Z. Sita, AVX Czech Republics (view abstract)

Shorting Failure in High Voltage Ceramic Capacitor with Floating Internal Electrode Structure; Y. Deng, Huawei Technologies Co. Lt (view abstract)

Session 5: New Technology and Manufacturing Processes    
Chairman: Erik Reed, Kemet Electronics

Complexities In The Deposition of Thin Film Resistors;
C. Grabbe, A. Das, R. Hufnagel, State of the Art Inc. (view abstract)     

New Polymer Dielectric For High Energy Density Film Capacitors;
P. Winsor, E. Lobo, Aerovox Corp., Z. Munshi, A. Ibrahim, Lithium Power Technologies, INc. (view abstract)

Dispersed Spherical Silver Particles for Electronic Applications;
I. Halaciuga D. Goia, Clarkson University (view abstract)

Inkjet Printing of Silver Nanoparticles for Electronic Applications ; K. Balantrapu, M. McMurran, D. Goia, Clarkson University (view abstract)

Session 6: Advancements in Processes & Materials
Chairman: Josef Sikula, Brno University of Technology

Mass Production Techniques for Chip Resistors;
S. Tsai, D. Ritchey, Yageo America Corp (view abstract)

Growing Importance of Polyalkylene Carbonate Binders for the Passive Component Industry; P. Ferraro, Empower Materials  (view abstract)

Multilayer Polymer Aluminum Electrolytic Capacitors with Polypyrrole as Cathode Materials; K. Zhang, Fujian Guoguang Electronics (view abstract)  

Advances in Class-I C0G MLCC and SMD Film Capacitors;
X. Xu, Kemet Electronics (view abstract)