Conference Program

Monday - Tuesday - Wednesday - Thursday Symposium
Monday, March 30
9:00 am -
12:00 pm 		TECHNICAL SEMINAR: Ultracapacitor Technology & Applications
This seminar will address latest technology in the design and manufacturing of Ultracapacitors for many new applications. The applications for these great products include those that need a quick burst of power, constant recharge without degradation and long operating life. New applications beyond hybrid automobiles are being developed such as power bridging, recapture of braking energy and expansion into many other renewable and clean energy applications for both solar power and wind farms. Attend this Seminar and get an update on the improving and expanding technology of Ultracapacitors.
Mike Everett, Chairman, Kilofarad International;
Vice President/Chief Technology Officer, Maxwell Technologies, Inc.
1:30 pm -
4:30 pm 		MARKET SEMINAR 2: Electronic Components 2009
Today’s electronics continue to innovate and WOW us as technology and science advance. Billions of electronic components must be manufactured to meet these demands. And, as always, manufacturers need to deliver greater performance at lower prices. What’s inside these tiny techno-wonders and can they really be produced at costs consumers are demanding? Who are the players in this movement and what has to be done to achieve success? Join us as an industry expert shares his one-of-a-kind analysis and predictions on where the passive electronic components industry is heading and what it will take to get there.
Dennis Zogbi, Founder & CEO, Paumanok Publications, Inc.
Tuesday, March 31
9:00 - 9:15 am Welcome and Awards
9:15 - 9:45 am Keynote - Impact of Counterfeit Components on the U.S. Industrial Base
Teresa Telesco, US Department of Commerce
9:45 am - 12:00 pm

Session 1: Harsh Environments and Unique Applications
Chairman: John Prymak, Kemet Electronics
1.1

New High Temperature Ceramic Material; (view abstract)
A. Devoe, Presidio Components
1.2

Robust Class-I Dielectric for High Temperature Applications; (view abstract)
X. Xu, J. Magee, M. Laps, A. Gurav, Kemet Electronics Corporation
1.3

Film Capacitors for Automotive and Industrial Applications; (view abstract)
D. Montanari, K. Saarinen, F. Scagliarini, D. Zeidler, M. Niskala, A. Sanua, C. Nender, M. Tsingos, Kemet Electronics Corp.
1.4

High Performance Polymer Film Dielectrics for Air Force Wide Temperature Power Electronics
Applications; (view abstract)
N. Venkar, T. Dang, J. DeCerbo, V. McNier, B. Tsao, J. Stricker, Univ. of Dayton Research Institute, Air Force Research Laboratory, Air Force Research Laboratory-Electrical Tech.
1.5

The Development of Electrolytes in Aluminum Electrolytic Capacitors for Automotive and High
Temperature Applications; (view abstract) Z. Dou, R. Xu, A. Berduque, BHC Components Ltd.
12:00 pm Lunch with Exhibits
2:00-3:30 pm

Session 2: Special Applications
Chairman: Josef Sikula, Brno University
2.1

A Charge-based Model for the Time Progression of Field Crystallization in Tantalum Pentoxide; J. Hossick-Schott, Medtronic Energy & Components Center            

2.2

Pulse Derating and EOL for Resistors for High Reliability Applications; (view abstract) M. Cozzolino, Raytheon SAS
2.3

Low Capacitance ESD Protection Devices; (view abstract) E. Jones, AVX Advanced Products & Technology Center
2.4

Challenge:  Highest Capacitance Tantalum Powders; (view abstract) H. Haas, C. Schnitter, N. Sato, H. Karabulut, Y. Fujimori, O. Thomas, H.C. Starck            

3:45 - 5:00 pm

Session 3: Ultracapacitor Technology and Applications
Presentations have been invited. Please check back for updates.
Chairman: Michael Everett, Maxwell Technologies Inc.
3.0

Overview of the Ultracapacitor Technology M. Everitt, Maxwell Technology
3.1

Electrochemical Capacitor Technology Basics for the Traditional Component Engineer; J. Miller, JME Inc.
5:30 - 7:00 pm Exhibits and Reception
Wednesday, April 1
7:00 am Registration
8:30

Session 4: Applications Considerations
Chairman: Dave Richardson, Vishay
4.1

High CV Tantalum Capacitors—Challenges and Limitations; (view abstract) S. Zednicek, I. Horacek, J. Petrzilek, P. Jacisko, P. Gregorova, T. Zednicek, AVX Czech Republic
4.2

Electrical Characterization of Polymer Tantalum Capacitors; (view abstract) Y. Freeman, Kemet Electronics
4.3

Broadband Antenna Design for Multiband WiMax Applications; (view abstract) D. Humphrey, TDK Electronics
4.4

Flexible Termination—Reliability in Stringent Environments; (view abstract) B. Sloka, P. Staubli, K. Lai, A. Hill, J. Prymak, C. Riedl, P. Blais, Kemet Electronics
4.5

Performance Improvement of a Coupled- Inductor Interleaved Boost Converter; (view abstract) B. Ray, Bloomsburg University of Pennsylvania
4.6

DC/DC Converter Output Capacitor Benchmark; (view abstract) R. Faltus, Z. Flegr, R. Sponar, M. Jane, T. Zednicek, AVX Czech Republic
4.7

Small Case Size Polymer Now Comes in Ultra low ESR; (view abstract) A. Chacko, J. Young, R. Hahn, Kemet Electronics
4.8

Dielectric Paper with Chitosan; (view abstract) A. Maslyakova, SPb State Polytechnical University, Russia

           
12:00 pm
Lunch with Exhibits
2:00 - 5:00 pm

Session 5: Testing and Reliability Issues and Solutions
Chairman: Randy Townley, Lockheed Martin
5.1

How to Measure Low-ESL Tantalum Polymer Capacitors; (view abstract) E. Reed, Kemet Electronics
5.2

Flaw Size Detectability in Barium Titanate Ceramic Capacitors; C. Pollock, Presidio Components Inc.
5.3

Field Crystallization in Tantalum Capacitors, DCL and Reliability; (view abstract) T. Zednicek, AVX Czech Republic; H. Leibovitz, AVX Tantalum, J. Sikula, Brno University of Technology
5.4

Effects of Material Characteristicsof Paste on Sintering Behavior of Termination Electrode in MLCC; (view abstract) C. Kim, Samsung Electro-Mechanics, Korea
5.5

Analysis on Discoloration of MLCC Dielectric in DPA; (view abstract) P. Xiao, Huawei Technology Co. Ltd., China
5.6

Ta and NbO High Voltage Capacitors: Leakage Current Kinetics for MnO2 and Conducting Polymer Cathode; (view abstract) J. Sikula, V. Sedlakova, H. Navarova, J. Majzner, Brno University, Czech Republic; M. Tacano, Meisei University, Japan; T. Zednicek, AVX Czech Republic
5.7

Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress; M. Alam, CALCE Dept. of Mechanical Engr.            

4:45 - 5:30 pm Tutorial on Capacitor Applications*
Speaker: John Prymak, Kemet Electronics
* These tutorials are free to all symposium attendees, however, adequate advance registration is required to attend the tutorials. Please be sure to mark your registration form for the tutorials.
Thursday, April 2
8:30 am - 12:00 pm

Session 6: Design and Manufacturing Approaches
Chairman: Tim Ginzsberg, Celestica
6.1

Classification of Non-IC Electronic Components for Assembly Processes; (view abstract) P. Krystek, IBM Global Procurement    

6.2

Method for Preparing Dispersed Copper Particles for Electronic Applications; (view abstract) D. Goia, I. Halaciuga, S. LaPlante, Clarkson University            

6.3

Electrical Properties of Polymer Aluminum Electrolytic Capacitors with Polyrrole as Cathode Material; (view abstract) Y. Zhang, Fujian Guoguang Res. Institute of Advanced Electrics, China
6.4

Electrical Properties of a Novel High CV Wet Tantalum Capacitor Systems; (view abstract) Doug Edson, AVX Tantalum Corp.
6.5
 Production of Tantalum Powders Using the Metalysis FFC Reduction Method; (view abstract) I. Margerison, Organization Metalysis, United Kingdom
6.6

Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications; (view abstract) D. Zhang, Heraeus Inc.            

12:00 pm End of CARTS USA 2009