Symposium
Papers will be presented on a wide range of technical subjects, including the impact of lead-free processes on reliability, new applications, active and passive interfacing, new technology, design and construction testing and reliability, and materials and processes.
| Wednesday, 10 November 0830 - 1800 |
Thursday, 11 November 0830 - 1630 |
| 0830—0930 Tutorial 1 Latest Development in Capacitor Technologies for Automotive Applications; Axel Schmidt, Paul Staubli, Kimmo Saarinen, Davide Montanari, KEMET Electronics Corp. 1000—1200 Session 1 Automotive & High Temperature Applications Chair: Dr. Tomas Zedníček, AVX 1.1 Requirements on passive components for electric and hybrid vehicles; W. Wondrak, A. Nisch, S. Pieger, A. Rodewald, M. Wagner, A. Willikens, P. Wurster, Daimler AG 1.2 Capacitors in Electric Drive Applications; A. Schmidt, P. Staubli, J. Prymak, KEMET Electronics Corp. 1.3 Robust Class - I BME ceramic capacitors for high temperature applications; T. Hollander, KEMET Electronics Corp. 1200—1400 Lunch electronica 2010 intermission 1400—1600 Session 2 Power Electronics Chair: Reiner Kuehl, Vishay 2.1 Optimization of Metallization in power capacitors for new applications; L. Cabo, EPCOS Electronic Components SA 2.2 Film Technology Advantages for Wind Power Applications; C. Reynolds, AVX Corporation 2.3 Power Film Capacitors for Industrial Applications; D. Montanari, KEMET Electronics Corp. 2.4 Circuit Protection Considerations for USB 3.0; A. Mikolajczak, Tyco Electronics 1630—1800 Session 3 Reliability & Testing Chair: Prof. Joseph Sikula, Brno University of Technology 3.1 Analysis of Weibull Grading Test for Solid Tantalum Capacitors; A. Teverovsky, Dell Perot Systems 3.2 Using the Arrhenius Equation to Predict Drift in Thin Film Resistors; R. W. Kuehl, Vishay 3.3 Hermetically Sealed Polymer Tantalum Capacitors; Y. Freeman, P. Lessner, J. Chen, T. Kinard, S. Hussey, KEMET Electronics Corp. |
0830—1045 Session 4 Electrolytic Performance & Materials Chair: Dr. Udo Merker, H. C. Starck 4.1 Performance of Aluminium Electrolytic Capacitors and Influence of Aluminium Cathode Foils; Z. Dou, R. Xu, A. Berduque, J. Qazi, C. Prince, KEMET Electronics Corporation 4.2 Next Generation of High Voltage, Low ESR Tantalum Conductive Polymer Capacitors; J. Petržílek, T. Zedníček, M. Uher, I. Horáček, S. Zedníček, AVX Czech Republic 4.3 Conductive polymer dispersions for aluminium capacitors; K. Bruder, H.C. Starck Clevios GmbH 4.4 High Capacitance Stacked Multi-Layer Ceramic Capacitors with Robust Performance; Tim Hollander, T. Ashburn, KEMET Electronics Corp. 1115—1200 Tutorial 2 Selecting Resistors to Avoid Unforeseen Stress Factors Yuval Hernik, Vishay Precision Group 1200—1400 Lunch electronica 2010 intermission 1400—1630 Session 5 New Technology Chair: Rob Derksen, Consultant 5.1 Ultrathin Discrete Capacitors for Emerging Embedded Technology; R. Uher, T. Zedníček, AVX Czech Republic 5.2 Effects of glass frit size on sintering behavior of copper termination paste in MLCC; C-H Kim, Samsung Electro-Mechanics 5.3 Manganese nitrate impregnation cycles optimization by addition of surfactants on Ta capacitors; A. Pimentel, KEMET Electronics Corp. 5.4 Power Dissipation considerations in high precision chip resistors and networks (high temp); D. Vignolo, Vishay—Sfernice Division 5.5 Leakage Current and Quantum Effects in Tantalum Capacitors; J. Sikula, Brno University of Technology |
